Surface process: Black Oil lead-free Kingdee
sided pcb
Fr-4 high TG material Thick gold sinking process
ITEMS
|
|
|
Parameter
|
|
|
|
|
||||||
|
|
|
Double side & Multi-layer
|
|
|
|
|
||||||
Number of Layers
|
|
|
1-20 layers
|
|
|
|
|
||||||
Board Materials
|
|
|
FR4,CME3,CME1,5G
|
|
|
|
|
||||||
PCB Size (Min- Max)
|
|
|
50x80mm to 1000mm×600mm ( 39.37"x23.6")
|
|
|
|
|
||||||
innerlayer line width/space(min)
|
|
|
4mil/4mil(100um/100um)
|
|
|
|
|
||||||
Finish Plating /Surface Finishes
|
|
|
HASL ,OSP,ENIG,HASL,gold finger,Au Panel,OSP,ENIG
|
|
|
|
|
||||||
innerlayer pad (min)
|
|
|
5mil(0.13mm)
|
|
|
|
|
||||||
Core thickness (min)
|
|
|
8mli(0.2mm)
|
|
|
|
|
||||||
Finisher Copper Inner Layers
|
|
|
1/2oz(17um)a-
|
|
|
|
|