- After curing, provide excellent mechanical to protect solder joints under thermal cycling conditions.
- Product Details
- {{item.text}}
Quick Details
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Brand Name:
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DeepMaterial
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Model Number:
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DM-6308
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Type:
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Epoxy Under-filler Adhesive
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Product series:
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epoxy base adhesive
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Colors:
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Black
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Dielectric constant @1GHz,25℃:
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3.10
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Curing time@25:
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≥8min @130°,5min @150°
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Specific Gravity:
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1.15
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Pot Life @25℃:
-
3 days
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mix Viscosity Pa.s:
-
380cps
-
Store:
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-40~-15℃
Quick Details
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CAS No.:
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DM-6308
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Other Names:
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Epoxy Under-filler Adhesive
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Place of Origin:
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Guangdong, China
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Brand Name:
-
DeepMaterial
-
Model Number:
-
DM-6308
-
Type:
-
Epoxy Under-filler Adhesive
-
Product series:
-
epoxy base adhesive
-
Colors:
-
Black
-
Dielectric constant @1GHz,25℃:
-
3.10
-
Curing time@25:
-
≥8min @130°,5min @150°
-
Specific Gravity:
-
1.15
-
Pot Life @25℃:
-
3 days
-
mix Viscosity Pa.s:
-
380cps
-
Store:
-
-40~-15℃
Products Description
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Product Name
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Epoxy Under-filler Adhesive
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Model No
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DM-6308
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Viscosity
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380cps
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Form
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epoxy base adhesive
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Curing Condition
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HEATING
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Application
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Suitable for chip stack and BGA underfill.
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// DM-6308 //
Suitable for chip stack and BGA underfill.
- Room temperature flow capability.
- Compatible with most Pb-free solders.
- Fast cure at moderate temperatures.
- Stable electrical performance in temperature humidity bias.
Product Series
Product Application
Industry Application
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