- Product Details
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Quick Details
-
Place of Origin:
-
Guangdong, China
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Brand Name:
-
OEM
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Copper Thickness:
-
1oz
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Min. Hole Size:
-
0.20mm
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Min. Line Width:
-
0.075mm/0.075mm(3mil/3mil)
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Min. Line Spacing:
-
0.05mm
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Surface Finishing:
-
immersion gold, osp etc
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Product name:
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Customized Multi Port Electronic Flexible Printed Circuit Board FPC
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Material:
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Polyimide/PET
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MOQ:
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1piece
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Service:
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ODM OEM EMS
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Application:
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FPC connectors
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Layer:
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1-6
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Certificates:
-
ISO9001:2008
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Customized:
-
Yes
Quick Details
-
Base Material:
-
Polyimide/PET
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Board Thickness:
-
0.075 ~0.4mm
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Model Number:
-
NH-A62
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Place of Origin:
-
Guangdong, China
-
Brand Name:
-
OEM
-
Copper Thickness:
-
1oz
-
Min. Hole Size:
-
0.20mm
-
Min. Line Width:
-
0.075mm/0.075mm(3mil/3mil)
-
Min. Line Spacing:
-
0.05mm
-
Surface Finishing:
-
immersion gold, osp etc
-
Product name:
-
Customized Multi Port Electronic Flexible Printed Circuit Board FPC
-
Material:
-
Polyimide/PET
-
MOQ:
-
1piece
-
Service:
-
ODM OEM EMS
-
Application:
-
FPC connectors
-
Layer:
-
1-6
-
Certificates:
-
ISO9001:2008
-
Customized:
-
Yes
Custom led flex fpc pcb without led micro switch fpc pcb
Product Description
All of our products are custom made from dimension, color, material requirment, cable length, tracks pitch, total thickness etc..
Also add special structure to make the products more attractive, like backlight, fluorecent etc..
Expect for getting your design idea, then we will work hard together to achieve it.
| FPC Parameter | |||
| Material | Polyimide (Kapton) | Polyester (PET) | Remarks&Test Merhod |
| Number of Layer | 1-6 layer | 1-2 layer | |
| Min. Line Width/Min. Line Spacing | Single side | 0.075(3mil) | |
| Double side | 0.075 (3mil) | ||
| Min.Hole Diameter | Drilling(P.T.H) | Ø 0.20mm | |
| Punching | Ø 0.5mm | ||
| Dimension Tolerance | Conducting Wire width(W) | ±0.03mm | W≤0.5mm |
| Hole Diameter(H) | ±0.05mm | H ≤1.5mm | |
| Accumulated spacing | ±0.05mm | P ≤25mm | |
| Outer Dimension(L) | ±0.05mm | L ≤50mm | |
| C onducting Wire and Outer(C) |
±0.075mm |
C ≤5.0mm | |
| Surface treatment | Ni(0.05-2um)/Au(0.05-1.25) | ||
| Pb/Sn(2-20um) Primary flux | |||
| H.A.L(for p olyimide only) | |||
| Chemical Ni(0.8-1.5um) | |||
| OSP | |||
| Insulation Resistance | 1000Ω | IPC-TM-650 2,5,3,2 at Ambient | |
| Dielectric Strength | 5KW | IPC-TM-650 2,5,6,1 | |
| Surface Resistance | 5*10 12 | 2* 10 12 | IPC-TM-650 2,5,1,7 |
| Volume Resistance | 1*10 15 | 1* 10 15 | IPC-TM-650 2,5,1,7 |
| Dielectric Constant(1MHz) | 4.0 | 3.0 | MIL-P-55617 |
| Divergence Coefficient (1MHz) | 0.04 | 0.03 | MIL-P-55617 |
| Peeling Strength(180 ℃ Direction) | 1.0kg f/cm | 1.2kg f/cm | IPC-TM-650 2,4,9 |
| Welding strength | 300 ℃ /10 secs | 210℃/10 secs | |
| Combustion assisting | 94 V-O | 94 V-O | UL94 |
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