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ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine
ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine

ODM Industrial control board Manufacturer of high TG electronic PCB printed circuit boards pcb manufacturing machine

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≥1 Pieces
US $10
≥100 Pieces
US $8
≥1000 Pieces
US $5
≥10000 Pieces
US $4.5
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Quick Details

Place of Origin:
Guangdong, China
Brand Name:
LHD
Copper Thickness:
1OZ
Min. Hole Size:
0.1mm
Min. Line Width:
3MIL
Min. Line Spacing:
3MIL
Surface Finishing:
ENIG
Board Size:
189*210/1UP
Product name:
Printed Circuit Board
Application:
Electronic Products
Usage:
OEM Electronics
Keywords:
Blank Pcb Board
Type:
COB Board
Service:
OEM Services Provided
Solder mask:
Green. Red. Blue. White. Black.Yellow
Battery type:
Lifepo4/lithium Battery
Certificate:
ISO9001/Iso14001/CE/ROHS
Voltage:
12V/24V/36V/48V/60V/72V

Quick Details

Base Material:
FR4
Board Thickness:
2mm
Model Number:
Medical device
Place of Origin:
Guangdong, China
Brand Name:
LHD
Copper Thickness:
1OZ
Min. Hole Size:
0.1mm
Min. Line Width:
3MIL
Min. Line Spacing:
3MIL
Surface Finishing:
ENIG
Board Size:
189*210/1UP
Product name:
Printed Circuit Board
Application:
Electronic Products
Usage:
OEM Electronics
Keywords:
Blank Pcb Board
Type:
COB Board
Service:
OEM Services Provided
Solder mask:
Green. Red. Blue. White. Black.Yellow
Battery type:
Lifepo4/lithium Battery
Certificate:
ISO9001/Iso14001/CE/ROHS
Voltage:
12V/24V/36V/48V/60V/72V
Product Description


Corporate introduction

We provide PCB/PCBA manufacturing, one-stop electronic manufacturing services. Our PCB portfolio contains variety of products; We can produce high reliability PCBs, from 2L to high multilayer, HDI, Rigid-flex, heavy copper, Semi-flex, IMS…. The application can be Automotive, Telecom, Industrial, Power, Energy, Defense, Medical, Consumer electronics, Aerospace, Railway. We make sure the production from prototype to volume is doing according to our processes and production specification. We have professional PCBA custom processing industry experience, from sample to volume production. Equipped with automatic high-speed SMT production line, and testing equipment.
Product Type
Vision(Micro/Mini LED),
Automotive(mm wave/E cars etc.),
Telecom(infrastructure),
Datacom(server,data center).
Industral,Energy,etc
Layer Count
2+2+2(B)
Thickness
1.65±0. 15mm
Material
EM370(Z)
Width/Space
50/50 um
Blind Via Size
0.075mm
Finish
ENIG
Special technology
Laser:D + 4mil ;Black PP
Application
LED display (Micro LED)
Layer Count
1+10+1(A)
Thickness
2.1±0.21mm
Materia
S7040G
Line Width/Space
75/100 um
Blind Via Size
0.1mm
Finish
ENIG+OSP
Special technology
Skip via，Core copper 2 oz
Application
Server
Layer count
12L
Min Hole :
0.2mm
Board thickness
2.1mm
Aspect ratio
10:1
Min. W/S
4.0mil/4.0mil
Materials
Hi-Tg FR4+PTFE
Back Drill/ Press fit Hole
Impedance:
100Ohm+/-10%
Surface finish
ENIG
Application:
Telecommunication
Layer count
14L
Min Hole
0.4mm
Board thickness
2.6mm
Copper thickness
3OZ
Min. W/S
10mil/8.2mil
Materials
Hi-Tg FR4
Surface finish
ENIG
Property
Metalline half hole, POFV
Application
Telecom power supply
Layer count
6L (1R+3F+2R)
Min hole size
0.25mm
Board thickness
1.2mm
Blind hole+POVF
Min. W/S
3.0mil/3.0mil
Materials
PI + High-Tg FR4
Surface finish
ENIG+Gold Finger
asymmetrical stack up
Application
Automotive
Specification
Items
Capability
Layer
32L
Finished board thickness
0.3-6mm
Aspect ratio
15:01
Copper thickness
12oz
Impedance
Single line
+/-8%
Differential line
+/-8%
Line width/space
Inner layer
2.5/2.5mil
Outer layer
3/3mil
Min hole size
6mil
Hole position tolerance
+/-3mil
PTH hole dimension tolerance
+/-2mil
NPTH hole dimension tolerance
+/-1mil
Solder mask
Line to solder PAD
3mil
Registration tolerance
+/-1.5mil
Peelable mask thickness
8-32mil
Carbon ink thickness
0.8-2mil
HAL/LF HAL thickness
SMD:40-2000u”
GND:30-800u”
Immersion Au
Au thickness
1-5u”
Ni thickness
80-200u”
Goldfinger
10-50u”
OSP
0.1-0.6um
Immersion tin
0.8-1.2um
Immersion silver
0.15-0.45um
Profile
Punching
+/-4mil
Routing
+/-3mil
Laminate type
FR4(Tg130-170)
Halogen free lamination
Rogers/Teflon/Aluminum base/Polyimide
Packing & Delivery
APP
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+86-17326049340