High purity Tantalum metal Sputtering Target for thin film coating,Titanium/Rhodium /Ruthenium Sputtering Target

[Product manual]

Tantalum, a metallic element, mainly exists in tantalite and co-exists with niobium. The texture of tantalum is very hard, the
hardness can reach 6-6.5. Its melting point is as high as 2996ºC, second only to tungsten and rhenium, ranking third. Tantalum is malleable and can be drawn into a thin wire-like foil. Its coefficient of thermal expansion is very small. It only expands by 6.6% per degree Celsius. In addition, its toughness is very strong, even better than copper. Tantalum also has extremely high corrosion resistance. It does not react to hydrochloric acid, concentrated nitric acid and "aqua regia" regardless of whether it is under cold or hot conditions.

[Application]
Tantalum target is usually welded with the copper back target, and then semiconductor or optical sputtering is carried out to deposit tantalum atoms as oxides on the substrate material to achieve sputtering coating. Tantalum targets are mainly used in semiconductor coating, optical coating and other industries. In the semiconductor industry, the metal tantalum (TA) is currently mainly used by physical vapor deposition (PVD) coating and forming a barrier layer as a target. With the rapid development of science and technology, the development of the semiconductor industry is the core of the entire high-tech industry, is a measure of a country's scientific and technological level and innovation ability of the commanding heights, thus by many countries attach great importance to, but also the top priority of technology blockade; At present, the frontier of semiconductor technology is very large scale integrated circuit manufacturing technology.

[Standard sizes]
Tantalum sputtering target specification: diameter (50-400)mm * thickness (3-28)mm, customer's special size and requirements can be negotiated Chemical composition