- Product Details
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Quick Details
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Base Material:
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FR-4/aluminum/cem-1/cem-3/FR-1
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Board Thickness:
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1.6mm
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Min. Hole Size:
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0.10mm
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Min. Line Width:
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0.10mm
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Min. Line Spacing:
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0.1mm4mil
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Surface Finishing:
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HASL
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Application:
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consumer electronics
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Certificate:
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ROSH, ISO9001
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Keywords:
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Pcba Board
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Coil Type:
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Single Coil
Quick Details
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Model Number:
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YCT23-TM055
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Place of Origin:
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Guangdong, China
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Brand Name:
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YCT
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Base Material:
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FR-4/aluminum/cem-1/cem-3/FR-1
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Board Thickness:
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1.6mm
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Min. Hole Size:
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0.10mm
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Min. Line Width:
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0.10mm
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Min. Line Spacing:
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0.1mm4mil
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Surface Finishing:
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HASL
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Application:
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consumer electronics
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Certificate:
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ROSH, ISO9001
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Keywords:
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Pcba Board
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Coil Type:
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Single Coil
Product Description
Gps Tracker 4G Pcb Rastreador Gps Pcb Pcba Gsm Gprs Pcba mini gsm gps tracker
A well designed circuit board means:
· A reduction in production problems
· Improved quality control
· Reduced costs
· Reduced manufacturing times
We are awarded ISO 9001:2000 certificate. Products are compliance with UL, CE, FCC, ROHS, REACH…etc international certificate. Our mission at Quality Concept is to provide the highest quality products to achieve highest customer satisfaction.
We work to supply small and large batches of competitively priced printed circuit boards to our customers.
GPS PCBA Boards
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PCBA Production Capacity
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Types of PCB assembly
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SMT (Surface Mounted Technology)
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THT (Through Hole Technology)
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Mixed (surface mount and through hole) technology
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Cable assembly
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Components
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Passive Component: small as 01005, 0201
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BGA, uBGA, QFN, POP, SOP,SSOP,PLCC,LGA
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Fine Pitch Parts: 0.25mm fine pitch parts
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Max Component Height: 25mm(SMT), Top 120mm/Bot 15mm (Wave-Solder)
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Component Package
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Reels, cut tape, Tube and tray, Loose parts and bulk
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Board Dimension
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Min Board Size: No Limited
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Max Board Size: 680 x 500mm
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Board Shape
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We can assemble boards in Rectangular, Circular and irregular
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Board Type
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Rigid PCB, Flexible PCB, Rigid-flex PCB
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Assembly process
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Lead-Free (RoHS)
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Design file format
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Gerber RS-274X
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BOM (Bill of Materials) (.xls, .csv, . xlsx)
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Centroid(Pick-N-Place/XY file)
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Electrical testing
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X-ray Inspection
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AOI (Automated Optical Inspection)
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Functional testing
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Certificate
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ISO13485, IATF16949, ISO9001,ISO14001
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Quality Standards
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IPC-A-600/IPC-A-610 compliance
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Type of Service
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Turn-key, partial turn-key or consignment
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Our products used in various fields such as consumer electronics, industrial control, telecommunication, computer and medical. Wedo not only offer the simple Fr4 PCB but also Alu PCB, Ceramic ALN and AL2O3, metal and copper base PCB, Rigid-flex board, heavycopper and etc.
Specification
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PCB Techinecal Capacity
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Layers
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Mass production: 2~58 layers / Pilot run: 64 layers
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Max. Thickness
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Mass production: 394mil (10mm) / Pilot run: 17.5mm
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Materials
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FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO,
PPE, Hybrid, Partial hybrid, etc |
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Min. Width/Spacing
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Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
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Max. Copper Thickness
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6.0 OZ / Pilot run: 12OZ
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Min. Hole Size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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Surface Finish
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HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control |
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PCBA technical Capacity
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Advantages
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----Professional Surface-mounting and Through-hole soldering technology
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----Various sizes like 1206,0805,0603 components SMT technology
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----ICT(In Circuit Test),FCT(Functional Circuit Test)
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----PCB Assembly With UL,CE,FCC,Rohs Approval
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----Nitrogen gas reflow soldering technology for SMT.
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----High Standard SMT&Solder Assembly Line
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----High density interconnected board placement technology capacity.
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Components
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Passive Down to 0201 size, BGA and VFBGA, Leadless Chip Carriers/CSP
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Double-sided SMT Assembly, Fine Pitch to 0.8mils, BGA Repair and Reball
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Testing
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Flying Probe Test,X-ray Inspection AOI Test
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SMT
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Position accuracy: 20 um
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Components size: 0.4×0.2mm(01005) —130×79mm, Flip-CHIP, QFP, BGA, POP
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Max. component height: 25mm
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Max. PCB size: 680×500mm
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Min. PCB size: no limited
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PCB thickness: 0.3 to 6mm
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Wave-Solder
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Max. PCB width: 450mm
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Min. PCB width: no limited
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Component height: Top 120mm/Bot 15mm
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Sweat-Solder
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Metal type: part, whole, inlay, sidestep
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Metal material: Copper, Aluminum
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Surface Finish: plating Au, plating sliver, plating Sn
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Air bladder rate: less than 20%
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Press-fit
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Press range: 0-50KN
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Max. PCB size: 800X600mm
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Packing & Delivery
Vacuum Packing with Carton Box
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