- Product Details
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Quick Details
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Description:
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electronic components
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Place of Origin:
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Guangdong, China
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Max. Forward Voltage:
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Standard
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Max. Reverse Voltage:
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Standard
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Max. Forward Current:
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Standard
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Max. Reverse Current:
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Standard
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Package / Case:
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Original
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Condition:
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New
Quick Details
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Model Number:
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1N4007
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Brand Name:
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GOLDELEWAY
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Mounting Type:
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Surface Mount
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Description:
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electronic components
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Place of Origin:
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Guangdong, China
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Max. Forward Voltage:
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Standard
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Max. Reverse Voltage:
-
Standard
-
Max. Forward Current:
-
Standard
-
Max. Reverse Current:
-
Standard
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Package / Case:
-
Original
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Condition:
-
New
Details Images
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Our advantage
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Material Technology
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Our Production
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General Production
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Regular/Special
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1.Our (TG170)FR4:
high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good performance in electrical charge, impact resistance, humidity-resistance 2.Our FR4 good performance in electrical charge, impact resistance, humidity-resistance 3.Our CEM no-burr 4.Our Rogers Good performance in high frequency 5.Our Aluminum Excellent heat dispersion |
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1.General FR4
High heat work
2.General CEM
Expand and deform in damp conditions
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Factory
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We have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes
surface brighter, cleaner and more smooth, and it helps reduce the cost. |
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Artificial production line
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Blind/buried via board, High Density Interconnect(1+1,N+1)
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Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design.
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Difficult manufacturer, high cost
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Impedance
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Good performance in reliability and stability of signal sending and receiving
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High cost
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Surface Technics
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1.IMG:smooth surface, good adhesion, no oxidation under long using
2.gold plating(thick gold:1-50U"):good wear-resistance 3.HASL:better price, not easy oxidation, easy to welding, smooth surface 4.HAL: better price, not easy oxidation, easy to welding |
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1.IMG:high price
2.Gold plating(thick gold):high price
3.HAL:surface is not flat, not suitable for BAG packaging
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Copper Via/Surface(20-25UM,0.5-60Z)
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Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM
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Hard to reach 0.1MM
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Multilayer board(4-20 L),BGA(CPU)
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BGA:high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN
width/space: 3/3MIL Multilayer board:strong microporous, high reliability |
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Difficult manufacturer,high cost
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Test
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To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework
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Careless
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