LY IR8500 Infrared BGA Rework Soldering Station for Laptop Motherboard Mobile Phone Repairing Machine Reballing Kit Tools 220V

LY IR8500 Infrared BGA Rework Soldering Station for Laptop Motherboard Mobile Phone Repairing Machine Reballing Kit Tools 220V

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US $499.5

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Product Details

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Quick Details

Use:: Repairing

Weight (KG):: 21 KG

Zones:: 2

Heating:: IR

Operations:: Manual / Software

Dimension:: L780mmx W450mmx H260mm

Total weight:: 21 kg

Power:: 220V AC

Size of Upper heating:: 80mm x 80mm

Consumption of upper heating:: 450W

Size of Bottom heating:: 400mm x200mm

Consumption of Bottom heating:: 1600W

Quick Details

Place of Origin:: Guangdong, China

Brand Name:: LY

Dimensions:: 780mmx 450mmx 260mm

Use:: Repairing

Weight (KG):: 21 KG

Zones:: 2

Heating:: IR

Operations:: Manual / Software

Dimension:: L780mmx W450mmx H260mm

Total weight:: 21 kg

Power:: 220V AC

Size of Upper heating:: 80mm x 80mm

Consumption of upper heating:: 450W

Size of Bottom heating:: 400mm x200mm

Consumption of Bottom heating:: 1600W

Product Description

LY IR8500 Infrared BGA Rework Soldering Station for Laptop Motherboard Mobile Phone Repairing Machine Reballing kit Tools 220V

Feature:

This is economic BGA model,substitute of IR-PRO-SC,if do small motherboard,can choose IR6500,if do big board,can choose IR8500.

Introduction

LY IR8500 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.

LY IR8500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.

Technical Parameters

Basic Parameters
Zones	2
Heating	IR
Operations	Manual / Software
Dimension	L780mmx W450mmx H260mm
Weight	18kg
Total weight	About 21 kg, vary with the different need of the users
Electrical Parameters
Power	220V AC
Upper Heating	IR
Size of Upper heating	80mm x 80mm
Consumption of upper heating	450W
Bottom Heating	IR
Size of Bottom heating	400mm x200mm
Consumption of Bottom heating	1600W
General power	2050W
Temperature Control
Control mode of Upper	Independent temperature control, high-precision closed-loop
	control, precision ± 0.5%, Alarm
Control mode of Bottom	Independent temperature control, high-precision closed-loop
	control, precision ± 0.5%, NO Alarm
Rework Function
SMD	Suit for welding, remove or repair packaged devices
	such as BGA,PBGA,CSP,multi-layer substrates, EMI
	metallic shield product and solder/lead free Rework welding
Size of applicable chips	≤70mm x70 mm
Size of applicable PCB	≤400mm x305mm

Packing list:

1× IR8500 BGA rework station

1x LY IR cover set

1× power cable

1× usb to rs232 port cable (with CD)

1× thermocouple

4x pcb jig with screw

1 x bottom support

1× CD of manual and software (if not get, may be lost in customs, please contact us)

Feature

1.CE Certification

2.LY IR8500 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large
circuit board BGA rework.

3.LY IR8500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.

4.It can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.

5.It sensitive temperature measurement sensor to obtain an accurate and instantaneous temperature reading and monitoring.

6.The BGA rework station the technology of closed-loop temperature control ensures accurate temperature process and even heat distribution.

7.Machine overall system integration Design, Rework station more integrated workbench area occupied by smaller, Didn't mixed and disorderly of cables.