- Product Details
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Quick Details
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Model Number:
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RB SIC, SSIC, SSIC+C
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Hardness:
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≥2200 HVO.5
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Density:
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≥3.03
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Rockwell:
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≥90HRA
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Compression Strength:
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≥2200Mpa
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Transverse Strength:
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≥350Mpa
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Elastic Conductivity:
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≥350Gpa
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Thermal Conductivity:
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30-130W/m*k
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Maximum Temperature:
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1000℃
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Coefficient of Heat Expansion:
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4-5/10-6*1℃
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Indicated Porosity:
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<0.2%
Quick Details
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Size:
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OD: 3~700mm
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Place of Origin:
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Sichuan, China
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Brand Name:
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ChampSealing
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Model Number:
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RB SIC, SSIC, SSIC+C
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Hardness:
-
≥2200 HVO.5
-
Density:
-
≥3.03
-
Rockwell:
-
≥90HRA
-
Compression Strength:
-
≥2200Mpa
-
Transverse Strength:
-
≥350Mpa
-
Elastic Conductivity:
-
≥350Gpa
-
Thermal Conductivity:
-
30-130W/m*k
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Maximum Temperature:
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1000℃
-
Coefficient of Heat Expansion:
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4-5/10-6*1℃
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Indicated Porosity:
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<0.2%
Products Description
The pressure-free sintering sub-micron silicon carbidepowder is sintered in a vacuum at a high temperature of 2160℃,High corrosion resistance is guaranteed due to its high density and its reliable under high temperature. These features combined with excelent surface finish characteristics can be applied to petrochemical, aerospace,and other extreme fields.
The material of pressure-free sintered silicon carbide is made of bySl-co-priced bonding atomic crystals and flexible carbon sintered ina vacuum at 2150℃,With corrosion resistance, wear resistance.high conductivity,high temperature and stable performance,SSlC+C are even less friction, and more suitable for instantaneousdrying or long-term semi-drying working conditions, Therefore,SSlC+C has awider range of application in the new energy chemical, marine and defense military fields.
The SlC use free silicon (content less than12%)added to reaction sintering sub-micronsilicon carbide powder and react with free silicon in a vacuum sintering furnace at 1500℃. Compared with other mechanicalseal,the silicon carbide seal ring has the advantages of low friction,low cost, light quality and many.
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Parameter
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Measurements
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|||
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Density
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g/cm3
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≥3.03
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3.08~3.15
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2.95~3.05
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Indicated Porosity
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%
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≤1%
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≤1%
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≤1%
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Crystal Size
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µm
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≤10
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≤10
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≤10
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Hardness
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Rockwell
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≥90
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≥92
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≥92
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Compressive Strength
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MPa
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3000
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3000
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≥2200
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Transverse Strength
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MPa
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≥350
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400
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≥200
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Maximum Temperature
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℃
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1200
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1600
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1500
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Elastic Modulus
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GPa
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350
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400
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≥250
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Thermal Conductivity
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W/m*k
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30~130
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30~130
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30~130
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Coefficient of Thermal Expansion
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1 x 10-6 / ℃
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4~5
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4~5
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4~5
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