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Quick Details
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Brand Name:
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DeepMaterial
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Model Number:
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DM-6180
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Type:
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Low Temperature UV Curing Adhesives
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Product series:
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UV Curing Adhesives
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Colors:
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White
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Viscosity:
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8700 cps
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Curing time:
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80℃ 2min
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Curing method:
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Heat curing
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TG:
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54℃
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Hardness:
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80D
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Store:
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*-40℃ /6 M
Quick Details
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CAS No.:
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DM-6108
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Other Names:
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UV Curing Adhesives
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Place of Origin:
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Guangdong, China
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Brand Name:
-
DeepMaterial
-
Model Number:
-
DM-6180
-
Type:
-
Low Temperature UV Curing Adhesives
-
Product series:
-
UV Curing Adhesives
-
Colors:
-
White
-
Viscosity:
-
8700 cps
-
Curing time:
-
80℃ 2min
-
Curing method:
-
Heat curing
-
TG:
-
54℃
-
Hardness:
-
80D
-
Store:
-
*-40℃ /6 M
Product Description
DeepMaterial Epoxy-Based COB Encapsulation UV Curing Adhesives
DeepMaterial's COB encapsulation UV curing adhesive can be heat cured or UV-cured with high reliability and low thermal swelling coefficient, as well as high glass conversion temperatures and low ion content. DeepMaterial's COB encapsulating UV curing adhesives protect wire leads, plumbum, chrome and silicon wafers from the external environment, mechanical damage and corrosion.
COB encapsulant can be used for wire bonding to provide environmental protection and increase mechanical strength. The protective sealing of wire-bonded chips includes top encapsulation, cofferdam, and gap filling. Adhesives with fine-tuning flow function are required, because their flow ability must ensure that the wires are encapsulated, and the adhesive will not flow out of the chip, and ensure that can be used for very fine pitch leads.
Application
Lead, epitaph and silicon wafers
Protection from environmental, mechanical damage and corrosion.
Lead bonding chip
Encapsulation, cofferdam, and gap filling
Flip chip
CCD/CMOS component and VCM motor assmbly
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Packing & Delivery
Company Introduction
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor, electronic applications and surface protection materials for chip packaging and testing.
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products.
Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
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