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low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue
low pressure overmolding bostik thermelt technomelt hot melt glue

low pressure overmolding bostik thermelt technomelt hot melt glue

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Quick Details

Model Number:
THERMELT 858 Black
Type:
Hot Melt Adhesives
Application:
Low pressure molding
Raw Material:
PA (Polyamide)
Features:
Water Resistance
Color:
Black
Certificate:
ROHS, UL94V0
Samples:
Accept
Certificates:
ROHS, REACH, ISO9001
Style:
Granule and stick
Flame Resistance:
V0, V2

Quick Details

CAS No.:
63428-83-1
Place of Origin:
France, France
Brand Name:
BOSTIK
Model Number:
THERMELT 858 Black
Type:
Hot Melt Adhesives
Application:
Low pressure molding
Raw Material:
PA (Polyamide)
Features:
Water Resistance
Color:
Black
Certificate:
ROHS, UL94V0
Samples:
Accept
Certificates:
ROHS, REACH, ISO9001
Style:
Granule and stick
Flame Resistance:
V0, V2
Specification
ITEM
SPECIFICATION
1. Limit temperatures for use
-40/+125 [°C]
2. Application temperature
210/230[°C]
3. Softening point
180 [°C]
4. Brookfield viscosity
4.4, At 220 [°C], Adjustable
5.Yield strength
4.4 [Mpa]
6. Elongation at break
340 [%]
7. Shore hardness(instant)
Shore D 49
8. Glass transition temperature
-30 [°C]
9.Moisture absorption (immersed 14 days)
1.9 [%]
10. UL 94 flammability test
V0
Electrical properties
1. Transversal resistivity (500V)
1.4*10^12 [Ω.cm]
2. Dielectric rigidity (23°C)
20 [kV/mm]
3. Relative permitivity (23°C)
5.6 Hz
Thermal properties
HDT B [°C]
43 [°C]
Vicat A120 [°C]
77 [°C]
Thermal conductivity @23°C
~0.2 [W/m.°K]
Thermal conductivity @180°C
~0.6[W/m.°K]
α coefficient of linear expansion
200-300 [ppm/°K]
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