Thermal Interface Materials are widely used for the heat conduction of IC and electronic products, which is to fill the small gap and rough holes between two materials, to reduce the thermal resistance and improve the thermal conductive performance. To keep the work temperature of the component junction within the safety temperature, the heat from the semiconductor must be transferred to the surroundings. The procedure include the heat transferred from the surface of device to the heatsink and the surroundings.
The heat sink should be attached with the device carefully to make the thermal resistance as small as possible. If attach the heat sink with surface of the semiconductor, it requires the two parts should be connected tightly. The surfaces are always rough,
which only can be seen under the microscope. When the two surfaces connected, only the high points are touched, the low points form the air gap. And there are over 90%of the contact zone are air gaps ,which means it will be the thermal resistance. The thermal interface materials can fill the air gap and the rough surface, its thermal conductivity is much higher that the air, through the TIMs, the thermal resistance of the junction will be less, and the temperature will be lower.
- Product Details
- {{item.text}}
Quick Details
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Rated Voltage:
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≥5.0KV
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Tensile Strength:
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/
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Color:
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Pink/Gray
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Thickness:
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0.18/0.23/ 0.3/0.5mm
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Continuous use Temp:
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-50~+200
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Breakdown Voltage:
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≥5.0KV
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Thermal Conductivity:
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1.0~1.8W/m.K
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Flame Rating:
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V-0
Quick Details
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Place of Origin:
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Guangdong, China
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Brand Name:
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LTD
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Model Number:
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LCV23-180
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Rated Voltage:
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≥5.0KV
-
Tensile Strength:
-
/
-
Color:
-
Pink/Gray
-
Thickness:
-
0.18/0.23/ 0.3/0.5mm
-
Continuous use Temp:
-
-50~+200
-
Breakdown Voltage:
-
≥5.0KV
-
Thermal Conductivity:
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1.0~1.8W/m.K
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Flame Rating:
-
V-0
Product Description
THERMAL INTERFACE MATERIALS INTRODUCTION:
LCV Series Thermal Silicone Cloth
The LCV series silicon cloth is a kind of cloth production which made based on fiberglass substrate through special processing. Because of its nice thermal conductivity, insulation and convenient assembly, it widely used in electronic appliances industry. When using, you should select different thickness of the thermal conductive silicon tape to cut according to the size of the fever interface and the height of the gap. Then putting the silicon tape in the gap between the fever interface and their components gap to play as a heat-conducting medium.
Features & Benefits:
Typical Applications:
l Automobile electronic heating module
l Power module
l Household appliances
l Computer and peripherals, the filling and any place need heat dissipation between the heating element and the bottom plate.
Specification
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Test Item
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Unit
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LCV Test Value
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LCV-23
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LCV-30
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LCV-45
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LCV-130
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LCV-160
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LCV-180
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|||||
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Color
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-
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Pink/Gray
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Gray
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Gray
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Pink/Gray
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Pink/Gray
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Pink/Gray
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|||||
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Thickness
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mm
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0.23±0.03
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0.3±0.03
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0.45±0.03
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0.18/0.23/
0.3/0.5 |
0.23/0.3/0.5
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0.23/0.3/0.5
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|||||
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Specific Gravity
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g/cm3
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1.7±0.1
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1.7±0.1
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1.7±0.1
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1.9±0.1
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2.35±0.1
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2.45±0.1
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|||||
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Hardness
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Shore A
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85±5
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85±5
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85±5
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80±5
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80±5
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80±5
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Continuous use Temp
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℃
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-50~+200
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-50~+200
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-50~+200
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-50~+200
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-50~+200
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-50~+200
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|||||
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Breakdown Voltage
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KV
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≥5.0
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≥5.0
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≥5.0
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≥4.0
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≥5.0
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≥5.0
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|||||
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Flame Rating
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UL94
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V-0
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V-0
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V-0
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V-0
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V-0
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V-0
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Thermal Conductivity
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W/m·K
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1.0
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1.0
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1.0
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1.3
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1.6
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1.8
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Specification: 300mm*50M/roll ; Customized sheet, die-cut form available.
Packing & Delivery
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
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