Explore More Products
- Product Details
- {{item.text}}
Quick Details
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
OEM/ODM
-
Copper Thickness:
-
1oz
-
Min. Hole Size:
-
0.25mm
-
Min. Line Width:
-
3mi
-
Min. Line Spacing:
-
0.003"
-
Surface Finishing:
-
HASL
-
Board Size:
-
Customized
-
Name:
-
OEM ODM PCB Assembly
-
layer:
-
1-48 layer
-
Material:
-
FR4 CEM1 CEM3 Hight TG
-
Certificate:
-
ISO9001
-
Type:
-
Customized
-
Application:
-
Communications
-
Solder mask color:
-
Black.Red.Yellow.White.Blue.Green
-
Service:
-
One-stop Service
-
Lead Time:
-
Mass Production:2 Weeks
-
Testing Service:
-
100% E-testing
Quick Details
-
Base Material:
-
FR-4
-
Board Thickness:
-
1.6mm
-
Model Number:
-
OEM
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
OEM/ODM
-
Copper Thickness:
-
1oz
-
Min. Hole Size:
-
0.25mm
-
Min. Line Width:
-
3mi
-
Min. Line Spacing:
-
0.003"
-
Surface Finishing:
-
HASL
-
Board Size:
-
Customized
-
Name:
-
OEM ODM PCB Assembly
-
layer:
-
1-48 layer
-
Material:
-
FR4 CEM1 CEM3 Hight TG
-
Certificate:
-
ISO9001
-
Type:
-
Customized
-
Application:
-
Communications
-
Solder mask color:
-
Black.Red.Yellow.White.Blue.Green
-
Service:
-
One-stop Service
-
Lead Time:
-
Mass Production:2 Weeks
-
Testing Service:
-
100% E-testing
Fumax Product Vs Other Product
PCB Fabrication (Rigid and Flex)
PCB Assembly (10 SMT & 8 DIP lines, IPC610 solering)
Complete Assembly (Component sourcing, PCB Assembly and Box building)
About US
AOI Team
DIP Line
Mold Line
Package
Through Hole Assembly
Wave Soldering Machine
Plastic
4 SMT Line(80000 pcs one day)
Safety warehouse
|
|
Supported Capabilities
|
|
Types of Assembly |
SMT (Surface-Mount Technology)
|
|
|
THD (Thru-Hole Device)
|
|
|
SMT & THD mixed
|
|
|
Double sided SMT and THD assembly
|
|
SMT capability
|
PCB layer: 1-40 layers;
|
|
|
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards;
|
|
|
Board type: Rigid FR-4, Rigid-Flex boards
|
|
|
PCB thickness: 0.2mm-7.0mm;
|
|
|
PCB dimension width: 40-500mm;
|
|
|
Copper thickness: Min:0.5oz; Max: 4.0oz;
|
|
|
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;
|
|
|
Component size: 0.6*0.3mm-33.5*33.5mm;
|
|
|
Component height: 6mm(max);
|
|
|
Pin spacing laser recognition over 0.65mm;
|
|
|
High resolution VCS 0.25mm;
|
|
|
BGA spherical distance: ≥0.25mm;
|
|
|
BGA Globe distance: ≥0.25mm;
|
|
|
BGA ball diameter: ≥0.1mm;
|
|
|
IC foot distance: ≥0.2mm;
|
Quality Assurance
Q: Why working with Fumax?
A: 1.Sign NDA (Non-disclosure Agreement) for All customers
2. Protect customer's copy right
3. small- to medium-volume are welcome
4. purchase all components based on client BOM list
5. One-stop turnkey solution
Q: What you need to provide for quote?
A: For OEM
1. BOM (Bill of Materials) & Gerber files
2.Testing Method
3.Software if need programming
For ODM
1. Detail funtion requirements of the project you want to development.
2. Board size /layers requirement
Q: How to contact us?
A: Send your inquiry details in the below. Click "Send" Now!
A: 1.Sign NDA (Non-disclosure Agreement) for All customers
2. Protect customer's copy right
3. small- to medium-volume are welcome
4. purchase all components based on client BOM list
5. One-stop turnkey solution
Q: What you need to provide for quote?
A: For OEM
1. BOM (Bill of Materials) & Gerber files
2.Testing Method
3.Software if need programming
For ODM
1. Detail funtion requirements of the project you want to development.
2. Board size /layers requirement
Q: How to contact us?
A: Send your inquiry details in the below. Click "Send" Now!
Hot Searches
