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Cas 7440-31-5 Superfine Pure 99.9% Metal Stannum Sn Powder / Tin Powder
Cas 7440-31-5 Superfine Pure 99.9% Metal Stannum Sn Powder / Tin Powder

Cas 7440-31-5 Superfine Pure 99.9% Metal Stannum Sn Powder / Tin Powder

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≥1 Kilograms
US $100
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Quick Details

Model Number:
Epoch-Chem
Shape:
gray black powder
Material:
Stannum
Chemical Composition:
Stannum
Product name:
Stannum powder
CAS No::
7440-31-5
Appearance:
gray black powder
Formula:
Sn
Purity:
99%-99.95%
Particle size:
50nm, 100nm, 325mesh, etc
Molecular Weight:
118.71
Melting Point:
231.9 °C(lit.)
Boiling point:
2270 °C(lit.)
Density:
7.3

Quick Details

Application:
Industry
Place of Origin:
Shanghai
Brand Name:
Epoch
Model Number:
Epoch-Chem
Shape:
gray black powder
Material:
Stannum
Chemical Composition:
Stannum
Product name:
Stannum powder
CAS No::
7440-31-5
Appearance:
gray black powder
Formula:
Sn
Purity:
99%-99.95%
Particle size:
50nm, 100nm, 325mesh, etc
Molecular Weight:
118.71
Melting Point:
231.9 °C(lit.)
Boiling point:
2270 °C(lit.)
Density:
7.3
Product Description

Brief introduction

1. Product name: Stannum Sn Powder / Tin Powder 2. Purity: 99.9% 3. Cas No: 7440-31-5 4. Particle size: 50nm, 100nm, 325mesh, etc
5. Appearance: gray powder


Characteristic .

Nano tin powder by variable current laser ion beam, chemical vapor deposition of industrialization production is big, high purity, uniform particle size, shape, good dispersibility, high oxidation temperature and good sintering shrinkage.

Application

1. Metal nanometer lubricating additives: add 0.1 ~ 0.5% nano tin powder to lubricating oil, grease, make the friction pair in the process of friction surface self-lubricating, self-healing membrane, significantly reduce the friction pair antiwear and
antifriction performance.
2. Activated sintering additives: nano tin powder in the powder metallurgy slash powder metallurgy sintering temperature and high temperature ceramic products.
3. Metal and non-metallic conductive coating on the surface treatment: under anaerobic conditions, below the powder coating of the melting point temperature, the technology can be used in the production of microelectronic device.

Specification
Grade
Sn-1
Sn-2
Sn-3
chemical composition (%)
Sn
99.9
99.9
99.9
Fe
<0.015
<0.015
<0.015
Pb
<0.04
<0.03
<0.04
S
<0.01
<0.01
<0.01
Cu
<0.04
<0.03
<0.03
Size
-200
-325
-100
Bulk Density(g/cm³)
3.3-4.3
3.2-3.8
3.6-4.6
Taylor Sieve(mesh)
150
<1
-
<10
200
3-10
<1
20-40
325
30-50
<5
20-40
-325
40-70
94-99
10-50
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