- Product Details
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Quick Details
-
Rated Voltage:
-
≥40, 40kv
-
Tensile Strength:
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≥340, 350-494MPa
-
Whole Board thickness:
-
1.6mm
-
Regular Size(length by width):
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1030*1230mm.
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Face of copper:
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single side
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Application Environment::
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High Temperature and High Voltage
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Service:
-
Free Sample
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Main Marketing:
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Brazil,Peru,Australian,Vietnam,Thailand,Southeast Asia
Quick Details
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Place of Origin:
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China
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Brand Name:
-
chifeng
-
Model Number:
-
CCL
-
Rated Voltage:
-
≥40, 40kv
-
Tensile Strength:
-
≥340, 350-494MPa
-
Whole Board thickness:
-
1.6mm
-
Regular Size(length by width):
-
1030*1230mm.
-
Face of copper:
-
single side
-
Application Environment::
-
High Temperature and High Voltage
-
Service:
-
Free Sample
-
Main Marketing:
-
Brazil,Peru,Australian,Vietnam,Thailand,Southeast Asia
Product description
FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.
|
Item Name
|
FR-4 Copper clad laminate
|
Copper Thickness
|
18um,25um,35um,70um
|
|
Size
|
40*48inch,41*49inch,43*49inch
|
Color
|
yellow/white/green/grey
|
|
Thickness
|
0.4mm,0.8mm,1mm,1.2mm,
1.6mm,2.4mm |
Glass Transition
Temperature |
135-155 °C
|
Relevant product parameters
|
Test Item
|
Test Condition
|
Unit
|
SPEC
|
Typical Value
|
|
Tg
|
DSC
|
°C
|
≥125
|
135
|
|
Peel strength(1OZ)
|
288°C,10S
|
N/mm
|
≥1.05
|
1.41
|
|
Thermal Stress
|
288°C,10S/solder dip
|
____
|
>10
|
60S/ No delamination
No Delamination |
|
Flexural Strength
|
N/mm2
|
LW
|
≥415
|
500
|
|
|
|
CW
|
≥345
|
450
|
|
Flammability
|
E24/125
|
____
|
UL94 V-0
|
V-0
|
|
Surface Resistivity
|
After moisture
|
MΩ
|
≥1. 0×104
|
2.0×106
|
|
Volume Resistivity
|
After moisture
|
MΩ.cm
|
≥1.0×106
|
2.0×108
|
|
Dielectric Constant(1MHZ)
|
1MHz C-24/23/50
|
____
|
≤5.4
|
4.7
|
|
Dissipation Factor(1MHZ)
|
1MHz C-24/23/50
|
____
|
≤0.035
|
0.017
|
|
Loss Tangent
|
1MHz C-24/23/50
|
____
|
≤0.035
|
0.016
|
|
Arc Resistivity
|
D-48/50+D-0.5/23
|
S
|
≥60
|
135
|
|
Dielectric Breakdown
|
D-48/50+D-0.5/23
|
KV
|
≥40
|
60
|
|
Moisture Absorption
|
D-24/23
|
%
|
≤0.8
|
0.15
|
|
CTI
|
IEC60112 Method
|
V
|
175~250
|
210
|
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