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PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba
PCB assembly factory for IMX8MM  Android development board motherboards pcba

PCB assembly factory for IMX8MM Android development board motherboards pcba

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≥1 Pieces
US $118
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Quick Details

Place of Origin:
Zhejiang, China
Brand Name:
Qiyang
Copper Thickness:
1oz
Min. Hole Size:
0.20mm
Surface Finishing:
HASL Lead Free
Board Size:
200mm*130mm
CPU:
i.MX8M Mini processor,Quad ARM Cortex-A53+Cortex-M4
RAM:
2GB LPDDR4
Flash:
16GB eMMC
Network:
Dual Gigabit Ethernet,WI-FI
Communication:
4*RS232
DISPLAY:
4-cn MIPI
Memory Interface:
SD card
Power Consumption:
≤5W
OS:
Android 9.0, Linux 4.14
speciality:
industrial grade

Quick Details

Base Material:
FR-4
Board Thickness:
1.6mm
Model Number:
IMX8M mini
Place of Origin:
Zhejiang, China
Brand Name:
Qiyang
Copper Thickness:
1oz
Min. Hole Size:
0.20mm
Surface Finishing:
HASL Lead Free
Board Size:
200mm*130mm
CPU:
i.MX8M Mini processor,Quad ARM Cortex-A53+Cortex-M4
RAM:
2GB LPDDR4
Flash:
16GB eMMC
Network:
Dual Gigabit Ethernet,WI-FI
Communication:
4*RS232
DISPLAY:
4-cn MIPI
Memory Interface:
SD card
Power Consumption:
≤5W
OS:
Android 9.0, Linux 4.14
speciality:
industrial grade
Product Description
Product Paramenters
CPU
NXP i.MX8M Mini processor,Quad ARM® Cortex™-A53+Cortex-M4, 1.8 GHz of i.MX8M, 400MHz of Cortex®-M4
RAM
1GB LPDDR4 ( up to 2GB LPDDR4)
FLASH
8GB EMMC, ( up to 16GB EMMC、32GB EMMC)


Network
1-ch AR8035 Internet chip adopts RGMII supporting adaptability l10M/100M/1000M

1-ch LAN 7430 port chip, supporting 10M/ 100M/1000M

Onboard WIFI (AP6236)


Communication
4-ch RS232, 2 port as the debug UART

4-ch USB 2.0, 1-ch USB-OTG

2-ch CAN 2.0
Display
4-ch MIPI each Display channel’ s resolution up to 1920 * 1200
Audio
McASP audio interface; binaural output; MIC audio input

Input
Standrad I2C Capacitive panel
1-ch CSI camera interface (4-ch)

Expansion
Interface

MINI-PCIE interface with SIM socket for 4g module
GPIO interface
Memory Interface
1-ch SD card
Other
Reset circuit, Watch dog, RTC, Buzzer, JTAG interface
Power Input
+12V power supply

Size
Core Board:55mm*60mm, 8-layer high precision immersion gold process
Back Board: 200mm*130mm,4-layer high precision immersion gold process
Power
Consumption
≤5W
Operation
Temperature
-40℃ ~ +85℃ ( industrial level ),0℃ ~ +85℃ (Consume Level, According to customers’ requirements)
Operation
Humidity

5% ~ 95%, Non-Condensing
Operate System
Operate System
Packing & Delivery
PP foam and carton box. 1 pc in a carton
APP
Post My RFQ
WhatsApp
+86-17326049340