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MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials
MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials

MDHYDS12B 12 inch discing saw High precision dicing machine suitable for cutting large package substrate materials

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US $46000
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Marketing Type:
Hot Product 2023

Quick Details

Place of Origin:
Guangdong, China
Brand Name:
minderhightech
Weight (KG):
1400
Marketing Type:
Hot Product 2023
Products Description
MDHYDS12B 12 inch discing saw
MDHYDS12B precision dicing machine is equipped with 2.4kw high-power DC spindle; high-rigidity portal structure; θ-axis DD motor drive; maximum workpiece size can reach 310*310mm, suitable for cutting large package substrate materials, and the cutting efficiency is relatively single-axis model It can be increased by up to 90%
MDHYDS8FA 8 inch discing saw
MDHYDS8FA precision dicing machine is equipped with 2.4kw high-power DC spindle; high-rigidity gate structure; θ-axis DD motor drive; imported high-precision lead screw and guide rail; dual lens alignment; software functions are further enhanced, and the degree of automation is significantly improved; Widely meet all kinds of processing needs.

MDHYDS12FA 12 inch discing saw

MDHYDS12FA is a 12-inch fully automatic precision dicing machine. This model realizes the automatic operation of wafer loading, alignment, cutting, cleaning and unloading. This model is equipped with high-power opposed dual-spindles. Both the Z1 and Z2 axes are equipped with NCS and special microscopes, which greatly reduces the alignment and inspection time, thereby reducing labor costs and improving production efficiency.
Specification
MDHYDS8FA
MDHYDS12B
MDHYDS12FA
Spec
dicing size
mm
ф8”〡□250
ф12”〡□300
ф420”〡□360
ф12”〡□275
dicing depth
mm
≤4mm or custom
≤4mm or custom
≤4mm or custom
Main spindle
rotaty speed
minˉ¹
6000∽60000
6000∽60000
6000∽60000
power
kW
DC,2.4at60000minˉ¹
DC,2.4at60000minˉ¹
DC,2.4at60000minˉ¹
X axis
stroke
mm
260
310
450
310
speed range
mm/s
0.1∽600
0.1∽800
0.1∽1000
Y axis
stroke
mm
260
170
310
resolution
mm
0.0001
310
450
0.0001
single move accuracy
mm
≤0.002/5
≤0.002/5
≤0.002/5
F accuracy
mm
≤0.005/260
≤0.005/310
≤0.005/310
Z axis
stroke
mm
40
40
40
max blade size:
mm
ф58
ф58
ф58
resolution
mm
0.00005
0.00005
0.00005
accuracy
mm
0.001
0.001
0.001
R axis
rotary range
deg
380
380
380
Basic required
power
KVA
4.0(three phase,AC380V)
5.0(three phase,AC380V)
7.0(three phase,AC380V)
air
Mpa L/min
0.5∽0.6max consumption260
0.5∽0.6max consumption400
0.5∽0.6max consumption550
cutting fluid
Mpa L/min
0.2∽0.3max consumption4.0
0.2∽0.3max consumption7.0
0.2∽0.3max consumption9.0
cooling water
Mpa L/min
0.2∽0.3max consumption1.5
0.2∽0.3max consumption3.0
0.2∽0.3max consumption3.0
exhaust
m³/min
5.0
8.0
8.0
size
mm
900*1050*1800
1170*1030*1850
1380*1300*1850
1200*1600*1800
weight
kg
1050
1400
1550
2000
Detail

Features:

√ Integrated cutting and cleaning;
√ Standard non-contact height measurement function (NCS);
√ Optional tool mark detection function;
√ Optional blade breakage detection function (BBD);
√ Optional workpiece shape detection function;
√ Optional data scanning input function;

Equipment workflow:

1. Lower the take-up arm to take out the material to be cut from the wafer box, place the material to be cut on the
pre-calibration table for pre-calibration, and then send it to the working plate for dicing.
2. The upper fetching arm moves the cut material from the work plate to the cleaning plate for two-fluid cleaning and wafer drying.
3. Lower the pick arm and put the cut material back into the pre-calibration table for pre-calibration, and then push it back
into the wafer box.

Conditions of Use:

1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the water temperature of the cutting water to room temperature 2ºC (fluctuation range within ±1ºC), and control the cooling water temperature to be the same as room temperature (fluctuation range control within ±1ºC).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.

Application areas:

IC, optical and optoelectronics, communications, LED packaging, QFN packaging, DFN packaging, BGA packaging

Precision cutting materials

silicon wafer, PCB board, EMC, ceramics, glass, quartz, gallium arsenide, lithium niobate, sapphire, crystal

Auto focus function:

Through the visual algorithm, coordinated with the motion control, the lens can be automatically raised and lowered, and the clear position of the workpiece image can be quickly obtained.
Accessories Consumables
Application field

Brand customers

Well-known company
Colleges and universities
Factory
FAQ
1. who are we?
We are based in Guangdong, China, start from 2014,sell to North America(00.00%),Western Europe(00.00%),South Asia(00.00%),Southeast Asia(00.00%),Mid East(00.00%),South America(00.00%), Eastern Asia(00.00%),Northern Europe(00.00%). There are total about 11-50 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;

3.what can you buy from us?
Soldering machine,Precision spot welding machine,Plasma cleaning machine,Glue dispenser,Screw machine

4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.

5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,FCA,CPT;
Accepted Payment Currency:USD,EUR,HKD,CNY;
Accepted Payment Type: T/T,PayPal,Cash;
Language Spoken:English,Chinese
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+86-17326049340