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Quick Details
-
Supplier Type:
-
OEM ODM EMS
-
Copper Thickness:
-
Customize, 0.5oZ~12oZ
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Service:
-
One-stop Turnkey PCBA Service
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Certificate:
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ISO9001/FCC/CE/ROHS
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Testing Service:
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AOI X-Ray Function Test
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Solder mask color:
-
Blue.green.red.black.white.etc
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Application:
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Electronics Device
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Layer:
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1-64 Layers
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PCBA service:
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OEM ODM EMS
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Base Material:
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FR-4/aluminum/ceramic/cem-3/FR-1
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MOQ:
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1 PCS
Quick Details
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Model Number:
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221230-09
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Place of Origin:
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GUA
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Brand Name:
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Custom
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Supplier Type:
-
OEM ODM EMS
-
Copper Thickness:
-
Customize, 0.5oZ~12oZ
-
Service:
-
One-stop Turnkey PCBA Service
-
Certificate:
-
ISO9001/FCC/CE/ROHS
-
Testing Service:
-
AOI X-Ray Function Test
-
Solder mask color:
-
Blue.green.red.black.white.etc
-
Application:
-
Electronics Device
-
Layer:
-
1-64 Layers
-
PCBA service:
-
OEM ODM EMS
-
Base Material:
-
FR-4/aluminum/ceramic/cem-3/FR-1
-
MOQ:
-
1 PCS
Our Strength
![](https://cdn.bestsuppliers.com/seo_products_img/fumax-tech/8bfa52b9b1343e7b88d333473cf48694.jpg!/rotate/180)
Fumax’s mission is to provide the solution of choice for OEMs who need a focused and responsive design and manufacturing partner for medium-volume, complex electronic products.
We have achieved and constantly renew all the certificates including ISO90001, CE, FCC, UL, and ROHS, to guarantee the highest quality products.
We have achieved and constantly renew all the certificates including ISO90001, CE, FCC, UL, and ROHS, to guarantee the highest quality products.
![](https://cdn.bestsuppliers.com/seo_products_img/fumax-tech/30eeb9bbdcaf3553bbf7302a832445e2.jpg!/rotate/180)
![](https://cdn.bestsuppliers.com/seo_products_img/fumax-tech/e7d12f7986983bee97e6b38fef4dd211.jpg!/rotate/180)
Special Service
One-stop Turnkey Service In PCB&PCBA
![](https://cdn.bestsuppliers.com/seo_products_img/fumax-tech/e41f989714e43e19be88a4525cd43368.jpg!/rotate/180)
Great Production Capacity:
10 high speed SMT lines
8 DIP soldering lines
4 Final Assembly lines
Daily output:
Sub-assemblies = est. 150K
Full assemblies = est. 60K
Product Testing = est. 60K
Product package = est. 200K
Note: The actual production
output will vary per different
products.
8 DIP soldering lines
4 Final Assembly lines
Daily output:
Sub-assemblies = est. 150K
Full assemblies = est. 60K
Product Testing = est. 60K
Product package = est. 200K
Note: The actual production
output will vary per different
products.
Manufacturing Process:
IQC (Incoming material checking)
Solder Paste Printing
SPI
SMT (BGA, QFN, 0201…etc)
Reflow Soldering (10 temp zone)
AOI (Auto Optical Inspection)
X-ray
ICT (In Circuit Testing)
DIP (Through-hole assembly)
Wave Soldering
Solder Paste Printing
SPI
SMT (BGA, QFN, 0201…etc)
Reflow Soldering (10 temp zone)
AOI (Auto Optical Inspection)
X-ray
ICT (In Circuit Testing)
DIP (Through-hole assembly)
Wave Soldering
Board Cleaning
Firmware programming
Function testing
Board Coating
Reliability testing (burn/in
life tests)
FQC (Final Quality Checking)
Package
Firmware programming
Function testing
Board Coating
Reliability testing (burn/in
life tests)
FQC (Final Quality Checking)
Package
Main Product
PCB
PCBA
FINISHED GOODS
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