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Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue
Optical organic silica gel for LED potting glue

Optical organic silica gel for LED potting glue

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Quick Details

EINECS No.:
DM-7841
Place of Origin:
Guangdong, China
Brand Name:
DeepMaterial
Model Number:
DM-7841
Type:
Optical organic silica gel for LED potting glue
Product name:
Optical organic silica gel for LED display potting glue
Material:
two-component optical organosilicon adhesive
Storage temperature:
-20-8℃
Curing method:
Heat curing
Color:
Transparent
Use:
packaging flexible transparent LED screens in COF process
Product Description:
wide applicability, stable viscosity, excellent yellowing resistance
Curing system:
heat curing process
Feature:
flame retardance
Glue type:
Epoxy resin-based

Quick Details

CAS No.:
DM-7841
Other Names:
Optical organic silica gel for LED potting glue
MF:
NONE
EINECS No.:
DM-7841
Place of Origin:
Guangdong, China
Brand Name:
DeepMaterial
Model Number:
DM-7841
Type:
Optical organic silica gel for LED potting glue
Product name:
Optical organic silica gel for LED display potting glue
Material:
two-component optical organosilicon adhesive
Storage temperature:
-20-8℃
Curing method:
Heat curing
Color:
Transparent
Use:
packaging flexible transparent LED screens in COF process
Product Description:
wide applicability, stable viscosity, excellent yellowing resistance
Curing system:
heat curing process
Feature:
flame retardance
Glue type:
Epoxy resin-based

PRODUCT DESCRIPTION

DeepMaterial's multi-purpose UV-curing adhesive can quickly polymerize and cure under ultraviolet radiation, which helps to greatly improve production efficiency. Widely used in bonding, wrapping, sealing, reinforcing, covering and sealing purposes. DeepMaterial multi-purpose UV curing adhesive is a one-component solvent-free product, which can be cured in a few seconds under UV or visible light. It has a fast curing speed, high bonding strength, large curing depth, good toughness, and anti-yellowing.
DeepMaterial adheres to the research and development concept of "market priority, close to the scene", and strives to fully meet the current rapid development of electronic products, update the current situation of itera- tion, and continuously improve products, fully meet the requirements of high-speed assembly process of electronic products, and be compatible with solvent-free environmental protection technology, To ensure that customer's production cost and efficiency are improved and the production concept of environmental protection and high efficiency is realized. The DeepMaterial multi-purpose UV curing adhesive product line covers the main applications of structural bonding.
The special formula of this product is suitable for the moisture-proof treatment of the COG or TAB installation terminal of the LCD module. The product's high flexibility and good moisture-proof characteristics improve the protection performance.

Product Description

PRODUCT FEATURE

  • Fast cure
  • One component
  • Cures in shadowed areas
  • Easy dispensability without stringing
  • Fluorescent under UV light

APPLICATION

  • For assembly process of electron product, especially protection of WLCSP and BGA on
    circuit board
  • Suitable for glass, metal, PC substrate adhesion in industrial applications, typical
    application is mainly used for electronic components of moisture-proof protection.

PHYSICAL PROPERTIES

Chemical composition
polymer
Number of components One-component epoxy adhesive
Technical characteristics
visible light curing adhesive
Applications
A two-component optical organosilicon packaging adhesive. The product has wide applicability, stable viscosity, excellent
yellowing resistance, and UL-94 V0 flflame retardance. It is suitable for packaging flflexible transparent LED screens in COF process.
Working temperature

Min.: -55 °C (-67 °F)

Max.: 150 °C (302 °F)

FAQ
FAQ

1. What’s the minimum order quantity(MOQ)?
- Minimum 1 unit, small batch and large volumes are acceptable.

2. When can I get the quotation?
- We usually respond within 24 hours on working days receiving your messages. After we receive the TDS report or sample, we will forward to you with quotation within one week.

3. Which is the safe payment method to trade?
- We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.

4. How long does it take to deliver?
- For standard adhesive, it will be 7 days for manufacturing.
- For non-standard adhesive, it will be negotiated customized according to your requirements.

5. What’s the shipping method?
- We are able to ship worldwide where Ocean shipping or Air shipping can reach.
- We have a professional packaging team. Products will be packed safely and protectively.

Factory Introduction

Our Factory specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.

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