- Product Details
- {{item.text}}
Quick Details
-
Core Components:
-
IPC, Piezoelectric ceramics
Quick Details
-
Place of Origin:
-
GUA
-
Brand Name:
-
Argotec
-
Weight (KG):
-
500
-
Core Components:
-
IPC, Piezoelectric ceramics
The AI Series Inline Dispensing Equipments utilize a compact mechanical layout. Different configurations such as ballscrew or linear direct drive motion system are available. Different applicators such as pneumatic or piezo-electric jet valves, screw valves, etc. can be installed to fulfill a large diversity of complex process requirements.
Features:
- High performance, high precision
- Integrated structural design yielding a compact layout
- High-quality core components to ensure reliability
- Long product lifetime and low cost of maintenance
- Powerful motion, vision, and software control systems to meet different production needs
- High performance, high precision
- Integrated structural design yielding a compact layout
- High-quality core components to ensure reliability
- Long product lifetime and low cost of maintenance
- Powerful motion, vision, and software control systems to meet different production needs
Multiple Configurations
- A comprehensive portfolio of hardware configurations are available for handling a multiplicity of production dimensions
- Dual-valve, dual-conveyor, three-sectioned conveyor, substrate heating, tilted dispensing, auto weighing, etc.
- Common-platform modular design approach allows for fast installation of different functional modules
- A comprehensive portfolio of hardware configurations are available for handling a multiplicity of production dimensions
- Dual-valve, dual-conveyor, three-sectioned conveyor, substrate heating, tilted dispensing, auto weighing, etc.
- Common-platform modular design approach allows for fast installation of different functional modules
Features:
- Non-contact dispensing:
Pneumatic and piezo-electric jetting
- High speeds:
pneumatic: up to 280 dots/s
piezo-electric: up to 1000 dot/s
- Modular design: Ease of maintenance
- Low cost of maintenance:
minimum wear parts
core parts are made of very durable material
- High precision
minimum dot volume 2-3nL
minimum dot diameter 0.15mm
- Non-contact dispensing:
Pneumatic and piezo-electric jetting
- High speeds:
pneumatic: up to 280 dots/s
piezo-electric: up to 1000 dot/s
- Modular design: Ease of maintenance
- Low cost of maintenance:
minimum wear parts
core parts are made of very durable material
- High precision
minimum dot volume 2-3nL
minimum dot diameter 0.15mm
AI Series Functional Modules
Dual-Valve Configuration
- Synchronous Operation: Two valves operate simultaneously to increase throughput
- Asynchronous Operation: Two valves operate separately, may be used for different glues or different processes
Dual-Conveyor Configuration
- May be used for increasing throughput (improve dispense head utilization)
- May be used for two different products / processes
- One of the conveyors may be used for empty carrier retrieval
Substrate Heating
- Air blown heating, to improve fluid flow
- Different types of heater and multi-zone heating available
Tilted Head Dispensing
- Maximum +/- 45 degrees tilting
- Supports down to sub-0.3mm line width dispensing
Dual-Valve Configuration
- Synchronous Operation: Two valves operate simultaneously to increase throughput
- Asynchronous Operation: Two valves operate separately, may be used for different glues or different processes
Dual-Conveyor Configuration
- May be used for increasing throughput (improve dispense head utilization)
- May be used for two different products / processes
- One of the conveyors may be used for empty carrier retrieval
Substrate Heating
- Air blown heating, to improve fluid flow
- Different types of heater and multi-zone heating available
Tilted Head Dispensing
- Maximum +/- 45 degrees tilting
- Supports down to sub-0.3mm line width dispensing
|
Model
|
|
AI-630
|
AI-800
|
|
|
Effective travel
|
X axis
|
250mm
|
350mm
|
|
|
|
Y axis
|
450mm
|
500mm
|
|
|
|
Z axis
|
50mm
|
50mm
|
|
|
Transmission mode
|
|
Ball screw
|
Ball screw
|
|
|
Max. speed
|
|
X/Y:1000 mm/s; Z:500 mm/s
|
X/Y:1500 mm/s; Z:500 mm/s
|
|
|
Max. acceleration
|
|
1g(X/Y)
|
1.5g(X/Y)
|
|
|
positioning accuracy
|
|
±30μm@3σ(X,Y)，±10μm@3σ(Z)
|
±20μm@3σ(X,Y)，±10μm@3σ(Z)
|
|
|
Repeat accuracy
|
|
±15 μm@3σ(X,Y)，±5μm@3σ(Z)
|
±10 μm@3σ(X,Y)，±5μm@3σ(Z)
|
|
|
Maximum load
|
|
Z:3kg，Track:3kg
|
Z:3kg，Track:3kg
|
|
|
Track height
|
|
890mm~965mm
|
890mm~965mm
|
|
|
Min. substrate size
|
|
50mm x 50mm
|
50mm x 50mm
|
|
|
Substrate thickness range
|
|
0.5mm＜T＜8mm
|
0.5mm＜T＜8mm
|
|
|
Control System
|
|
IPC
|
IPC
|
|
|
Software function
|
|
Visual positioning and inspection, batch modification, array copy, automatic fillet, height detection, CAD import, Jet on the fly
|
Visual positioning and inspection, batch modification, array copy, automatic fillet, height detection, CAD import, Jet on the fly
|
|
|
Power
|
|
AC220V(±10%) / 50HZ / 1400W
|
AC220V(±10%) / 50HZ / 2400W
|
|
|
Size(without PC)
|
L
|
1200mm
|
1200mm
|
|
|
|
W
|
650mm
|
750mm
|
|
|
|
H
|
1500mm
|
1500mm
|
|
|
Weight
|
|
500kg
|
800kg
|
|
|
AV-8000
|
|
|
||
|
No.
|
Item
|
Data
|
||
|
1
|
Dimensions (LxDxH)
|
102mmx85mmx12mm
|
||
|
2
|
Net weight
|
0.42kg
|
||
|
3
|
The highest dispensing speed
|
500 points/sec
|
||
|
4
|
Minimum dispensing diameter
|
150μm
|
||
|
5
|
Nozzle diameter
|
0.05mm ~0.3mm
|
||
|
6
|
Feed air pressure
|
Max.0.5Mpa
|
||
|
AJC-53
|
|
|
||
|
1
|
Dimensions (LxDxH)
|
242mm×163mm×138 mm
|
||
|
2
|
Net weight
|
2.8kg
|
||
|
3
|
Input power
|
220V±10%/50HZ
|
||
|
4
|
Minimum valve opening/closing time
|
0.1ms
|
||
|
5
|
Minimum rise/fall time
|
0.1ms
|
||
|
6
|
Trigger input
|
24V pulse or short circuit signal
|
||
|
7
|
Communication interface
|
RS232
|
||
Typical applications
●
VCM
● Lens Fixing
● Lens Holder Adhesive Dispensing
● Flip-chip Underfill for Image Sensor
◆ Fingerprint recognition
● IC encapsulation
● Chip underfill
● Metal frame bonding
◆ Smart phone assembly
● Sealing for Cover Frame
● Chip Encapsulation and Underfill for FPC Assembly
◆ Acoustics Devices
● Ear Phone, Speaker and Microphone Assembly
● Speaker Frame and Membrane Assembly
● Coil Assembly
◆ MEMS
● Au Wire Encapsulation
● Solder Paste Acoustical Seal
◆ Vibration Motor
● Lids sealing
● Weld pad protection
● Lens Fixing
● Lens Holder Adhesive Dispensing
● Flip-chip Underfill for Image Sensor
◆ Fingerprint recognition
● IC encapsulation
● Chip underfill
● Metal frame bonding
◆ Smart phone assembly
● Sealing for Cover Frame
● Chip Encapsulation and Underfill for FPC Assembly
◆ Acoustics Devices
● Ear Phone, Speaker and Microphone Assembly
● Speaker Frame and Membrane Assembly
● Coil Assembly
◆ MEMS
● Au Wire Encapsulation
● Solder Paste Acoustical Seal
◆ Vibration Motor
● Lids sealing
● Weld pad protection
Hot Searches
