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Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer
Automatic diamond dicing saw machine for silicon wafer

Automatic diamond dicing saw machine for silicon wafer

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≥1 Pieces
US $35000
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Quick Details

Rated Power:
3KW
Dimension(L*W*H):
602*888*2060
Weight (KG):
550 KG
After Warranty Service:
Online support
Weight:
550
Certification:
CE ISO

Quick Details

Place of Origin:
Guangdong, China
Brand Name:
MINDERHIGHTECH
Voltage:
380V
Rated Power:
3KW
Dimension(L*W*H):
602*888*2060
Weight (KG):
550 KG
After Warranty Service:
Online support
Weight:
550
Certification:
CE ISO

AUTOMATIC

Dicing Saw

MDQS3260/3380

MDZD36120

Application:

IC,LED,S olar cell,optical glass,optical fibre.

Ceramic, silicon wafer, QFN,BGA,PCB,GaAs,GaP.

Quarts,Lithium tantalum, sensitive resistor materials.

Principle and character:

>MDQS3260 for  6” or 245*164mm MDQS3380 for 8” or 260*260mm sq. and MDZD36120 for 12” workpiece.

>Automatically cutting, automatic alignment, automatic focus, automatic kerf check, and other image recognition functions.

>Placed on and removed from the chuck table by hand.

>Easy of use, it provided a Graphical User Interface(GUI) system by LCD touch screen.

>Real-time display the process status.

>With bridge shape structure can reduce the vibration and improve stability and cut quality.

>Shaft lock for easier blade changing.

>High quality component like spindle as well as guide screw etc.

>Customize fully automatic dicing saw(including unloading from cassette and unloading to cassette).

Specification:

MDQS3260

MDQS3380

MDZD36120

Workpiece size

mm

6’’ or 156*156mm

8’’ or 260*260

8’’ or 12’’ 300*300

X-axis

cutting range(mm)

245

260

300

cutting speed(mm/s)

0.01-400

0.01-500

0.1-600

Y-axis

cutting range(mm)

165

260

300

single error(mm)

0.003

0.002

0.003

total error(mm)

0.005/160

0.003/260

0.003/200

Z-axis

Max.stroke(mm)

20

30

20

blade size(mm)

d50-d63.4

d50-d63.4

d50-d58

repeatability(mm)

0.003

0.002

0.002

θ- axis

rotating angle(deg)

320

380

380

Spindle

output(kW)

1.5

1.8

1.8

speed(rpm)

3000-60000

0-60000

6000-60000

Align system

magnification

150X

150X

150X

display

15’’ touch screen

17’’ touch screen

17’’ touch screen

Power

AC 3*380V+-10%

Air source

pressure(MPa)

0.5-0.8

consumption(L/min)

300

Water

cutting area(L/min)

3

main spindle cutting

(L/min)

1.5

Dimension

mm

602*888*2060

1080*1040*1900

1080*1040*1990

Weight

kg

550

990

1020

Accessary: ceramic/metal chuck table, blade,blade maintain plate…….

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See more Chinese machine on semiconductor industry please see below links:

http://minder-hightech.en.alibaba.com/productgrouplist-802634918/Semiconductor_Industry.html

Contact

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+86-17326049340