Shenzhen Zens Eletronic Co.,Ltd.Aim to be a leading Manufacturer of AOI(Automatic optic inspection)equipment and Laser marking machine as World Class standards. We also provide technical supports after sales and full SMT line equipment for sell and rent, such as soldering printer, pick and place machine, reflow oven, X-ray equipment and SMT related products. Our company ensures high satisfaction both in products quality and after sales.
- Product Details
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Quick Details
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Applicable Components:
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0402-50mm * 50mm
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Speed:
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8000CPH
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Weight:
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Approx. 1410kg
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Dimension:
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1400 * 1300 * 1551 mm
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PCB thickness:
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0.40 mm (min) -4 mm (max)
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Substrate size:
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Min 50 * 30 mm, Max410 * 360mm
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Mounting accuracy:
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± 0.1mm / chip (when laser recognition)
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Power supply:
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single-phase AC200V, 50HZ, 2.5KVA
Quick Details
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Weight (KG):
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1250
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Place of Origin:
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Japan
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Model Number:
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KE-760
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Applicable Components:
-
0402-50mm * 50mm
-
Speed:
-
8000CPH
-
Weight:
-
Approx. 1410kg
-
Dimension:
-
1400 * 1300 * 1551 mm
-
PCB thickness:
-
0.40 mm (min) -4 mm (max)
-
Substrate size:
-
Min 50 * 30 mm, Max410 * 360mm
-
Mounting accuracy:
-
± 0.1mm / chip (when laser recognition)
-
Power supply:
-
single-phase AC200V, 50HZ, 2.5KVA
Products Description
Automatic pick and place machine KE760 smd mountering machine Pcb manufacturing equipment
1.PCB thickness: 0.40 mm (min) -4 mm (max)
2.Applicable Component : 0402-50mm * 50mm (CHIP, SOT, SOP, MELF, QFP, CONNECTOR, PLCC)
3.Component height: 0.3mm-10.5mm.
4.Pin pitch (Min): 0.4mm.
5.Component Dimensions: 0.5mm * 1.0mm (Min), 23.5mm * 23.5mm (Max).
6.Mounting speed (Max): 0.32 sec / CHIP, 1.8 / sec QFP) 8000 chip/ hour
7.Mounting accuracy: ± 0.1mm / chip (when laser recognition) ± 0.09mm / QFP (laser recognition)
8.Placement rhythm (2 heads mount at the same time when the adsorption of alternate placement) Maximum (theoretical speed: 0.2 8 s/ chip)
9.Substrate size Min 50 * 30mm; Max410 * 360mm
10. Type of components: Max 20 * 20 mm, can be posted P 0.4 mm BGA and PLCC pin IC.
11.Power: single-phase AC200V, 50HZ, 2.5KVA
12.Air pressure and air consumption: 0.5 ± 0.05Mpa, 150N1 / min
13.Substrate size: Min 50 * 30 mm, Max410 * 360mm
14.Dimensions: 1400 * 1300 * 1551 mm
15.Weight: 1150 kg
2.Applicable Component : 0402-50mm * 50mm (CHIP, SOT, SOP, MELF, QFP, CONNECTOR, PLCC)
3.Component height: 0.3mm-10.5mm.
4.Pin pitch (Min): 0.4mm.
5.Component Dimensions: 0.5mm * 1.0mm (Min), 23.5mm * 23.5mm (Max).
6.Mounting speed (Max): 0.32 sec / CHIP, 1.8 / sec QFP) 8000 chip/ hour
7.Mounting accuracy: ± 0.1mm / chip (when laser recognition) ± 0.09mm / QFP (laser recognition)
8.Placement rhythm (2 heads mount at the same time when the adsorption of alternate placement) Maximum (theoretical speed: 0.2 8 s/ chip)
9.Substrate size Min 50 * 30mm; Max410 * 360mm
10. Type of components: Max 20 * 20 mm, can be posted P 0.4 mm BGA and PLCC pin IC.
11.Power: single-phase AC200V, 50HZ, 2.5KVA
12.Air pressure and air consumption: 0.5 ± 0.05Mpa, 150N1 / min
13.Substrate size: Min 50 * 30 mm, Max410 * 360mm
14.Dimensions: 1400 * 1300 * 1551 mm
15.Weight: 1150 kg
Our company
ABOUT US
Product Exhibition
Our Services
1. Quick response within 24 hours;
2. Offer free spare parts and service within one year of warranty,but all the other relative cost should be on the buyer's
account;
3. Technology Support :Provide Demo operation video for training ;If you have time,welcome to our company,we will arrange
engineers to show you the operation;
4. Good and professional after-sales service.
2. Offer free spare parts and service within one year of warranty,but all the other relative cost should be on the buyer's
account;
3. Technology Support :Provide Demo operation video for training ;If you have time,welcome to our company,we will arrange
engineers to show you the operation;
4. Good and professional after-sales service.
Packing&Shipping
Package:
1)Standard box package for light and small item;
2)Strong wood package for heavy and large equipment;
Shipping way:
1)By air ,for sample and small package ,wordwide express like DHL,UPS,FedFX,EMS....
2)By sea, for large package and quantity;
3)By car or other ways as customer requested;
1)Standard box package for light and small item;
2)Strong wood package for heavy and large equipment;
Shipping way:
1)By air ,for sample and small package ,wordwide express like DHL,UPS,FedFX,EMS....
2)By sea, for large package and quantity;
3)By car or other ways as customer requested;
FAQ
1.
who are we?
We are based in Guangdong, China, start from 2008.We provide technical supports after sales and full SMT line equipment for sell and rent, such as solder paste printer,AOI inspection machine, pick and place machine, reflow oven, X-ray equipment and SMT related products like pcb loader and unloader. Our company ensures high satisfaction both in products quality and after sales.
2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;
3.
This is the first time I use this kind of machine, is it easy to operate?
There is english manual or guide video that show you how to use machine.
If you still have any question, please contact us by e-mail / skype/ phone /trademanager online service.
4. why should you buy from us not from other suppliers?
we have many oversea after-service office like US, Mexico,Inida,Thiland,Russia if any any technical assistant could provide
5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW；
Accepted Payment Currency:USD,CNY;
Accepted Payment Type: T/T,L/C,Western Union,Cash;
Language Spoken:English,Chinese
Contacts us
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Contracts
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Wendy Lai
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whatsapp
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+86 13642248175
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Tel
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+86 13642248175
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Wechat
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m13437727617
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Email
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sales02@zens-china.com
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Website
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http://zse.en.alibaba.com
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