- Product Details
- {{item.text}}
Quick Details
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
SenYan
-
Copper Thickness:
-
1-2oz
-
Min. Hole Size:
-
4mil
-
Min. Line Width:
-
4mil
-
Min. Line Spacing:
-
4mil
-
Surface Finishing:
-
HASL/immersion silver/gold finger/OSP
-
Board Size:
-
oem
-
Product name:
-
Environmental Protection Process Fr4 Glass Fiber Board
-
Keywords:
-
Blank Pcb Board
-
Certificate:
-
ISO9001/Iso14001/CE/ROHS
-
Material:
-
FR4 /aluminum/ceramic CEM1
-
Solder mask:
-
Green. Red. Blue. White. Black.Yellow
-
MOQ:
-
1pcs
-
Service:
-
ODM OEM
-
Application:
-
Electronic Product
-
Usage:
-
OEM Electronics
-
Type:
-
Electronic Board
Quick Details
-
Base Material:
-
FR-4
-
Board Thickness:
-
0.2-2mm
-
Model Number:
-
SY-HEP1230
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
SenYan
-
Copper Thickness:
-
1-2oz
-
Min. Hole Size:
-
4mil
-
Min. Line Width:
-
4mil
-
Min. Line Spacing:
-
4mil
-
Surface Finishing:
-
HASL/immersion silver/gold finger/OSP
-
Board Size:
-
oem
-
Product name:
-
Environmental Protection Process Fr4 Glass Fiber Board
-
Keywords:
-
Blank Pcb Board
-
Certificate:
-
ISO9001/Iso14001/CE/ROHS
-
Material:
-
FR4 /aluminum/ceramic CEM1
-
Solder mask:
-
Green. Red. Blue. White. Black.Yellow
-
MOQ:
-
1pcs
-
Service:
-
ODM OEM
-
Application:
-
Electronic Product
-
Usage:
-
OEM Electronics
-
Type:
-
Electronic Board
Specification
|
Layer
|
1-20 layer
|
|
Material Type
|
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
|
|
Board Thickness
|
0.21mm to 7.0mm
|
|
Copper Thickness
|
0.5 OZ to 6 oz
|
|
Size（Custom）
|
Max. Board Size: 580mm×1100mm
|
|
|
Min. Drilled Hole Size: 0.2 mm (8 mil)
|
|
|
Min. Line Width: 4mil (0.1mm)
|
|
|
Min. Line Spacing: 4mil (0.1mm)
|
|
Surface Finishing
|
HASL / HASL lead free, HAL, Chemical tin,
|
|
|
Immersion Silver / Gold, OSP, Gold plating
|
|
Solder Mask Color
|
Green / Yellow / Black / White / Red / Blue
|
|
Tolerance
|
Shape tolerance: ±0.13
|
|
|
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
|
|
Certificate
|
International Certification Standards
|
|
Special Requirements
|
Buried and blind vias+controlled impedance +BGA
|
|
Profiling
|
Punching, Routing, V-CUT, Beveling
|
Product Description
Recommend Products
Application Field
Hot Searches
