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Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent
Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

Epoxy Resin Hardener D230 For Polyamide Hot Melt Adhesive/ Electronic Sealing Glue Curing Agent

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≥20 Kilograms
US $5
≥100 Kilograms
US $4.5
≥1000 Kilograms
US $4.2
≥10000 Kilograms
US $4
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Quick Details

EINECS No.:
231-545-4
Place of Origin:
Guangdong, China
Brand Name:
Boqiao
Model Number:
YH1145AB
Type:
Two Component
Product name:
Potting Glue For Electronic
Application:
Sealing Construction
Keywords:
electronic potting glue
Viscosity:
40000-45000
Advantage:
Suitable High Temperate Climates
Color:
Transparent
Material:
Pure Epoxy
MOQ:
1 KG
Certificate:
rohs
Packing:
Bottle

Quick Details

CAS No.:
67763-03-05
Other Names:
epoxy resin and hardener
MF:
mSiO2 nH2O
EINECS No.:
231-545-4
Place of Origin:
Guangdong, China
Brand Name:
Boqiao
Model Number:
YH1145AB
Type:
Two Component
Product name:
Potting Glue For Electronic
Application:
Sealing Construction
Keywords:
electronic potting glue
Viscosity:
40000-45000
Advantage:
Suitable High Temperate Climates
Color:
Transparent
Material:
Pure Epoxy
MOQ:
1 KG
Certificate:
rohs
Packing:
Bottle

Product Description

BEFORE YOU BUY

NOTE!!!!!!

Before you place order, please contact me to confirm shipping cost!

Before Curing:

Items

Units/conditions

Part A

Part B

Viscosity

(mpa.s) 25℃

12000~14000mpa.s

100~300mpa.s

Density

g/cm 3 25℃

1.75

1.13

Ratio

weight

3

1

volume

2.5

1

Operative time

M ins at 25℃

150g

30-45mins

gel time

25℃

2-4 hrs

C uring time

25℃

24-48 hrs

80

1 hr

L ife span

12 months

After Curing:

Items

Units/conditions

Technical Data

Viscosity

Shore-D

80-85

Volume resistivity

25℃/ Ω./ cm

>1.4x10 15

Surface resistivity

25℃/ Ω.

>1.2x10 14

Dielectric strength

25℃ KV/MM

4.80-5.30

Coefficient of linear expansion

CM/K

<6.1x10 -5

Glass transition temperature

>90

Temperature resistant

-60 ~ 120


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