- Product Details
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Quick Details
-
Brand Name:
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HONGTUO
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Model Number:
-
HT-CK3
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APPLICATION SIZE:
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2,3,4,5,6,8,12 ince
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Application:
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Semiconductor disc
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Machine:
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Backside grinding, dicing saw
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Type:
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Porous ceramic and metal
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MOQ:
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1
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Payment:
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T/T
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Abrasive:
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Ceramic
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Application Machine:
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Disco
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Advantage:
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Easy dress
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Certificate:
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ISO9001
Quick Details
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Number of Jaws:
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4
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Material:
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Stainless steel
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Place of Origin:
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Henan, China
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Brand Name:
-
HONGTUO
-
Model Number:
-
HT-CK3
-
APPLICATION SIZE:
-
2,3,4,5,6,8,12 ince
-
Application:
-
Semiconductor disc
-
Machine:
-
Backside grinding, dicing saw
-
Type:
-
Porous ceramic and metal
-
MOQ:
-
1
-
Payment:
-
T/T
-
Abrasive:
-
Ceramic
-
Application Machine:
-
Disco
-
Advantage:
-
Easy dress
-
Certificate:
-
ISO9001
Metal Chuck Table For Semiconductor Wafer on Dicing Saw
Porous ceramic chuck table is used for supporting and chucking wafer.we export these series chuck to Japan,Germany and some other countries.
Feature:
1.High flatness and parallelism
2.Uniform size and distribution
3.Object suction
4.Easy dress
Applicable machine:grinder for wafer and dicing saw.
Type:ceremic and metal
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