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Quick Details
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Place of Origin:
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Guangdong, China
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Brand Name:
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FS
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Copper Thickness:
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0.4-2mil(10-50um)
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Min. Hole Size:
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0.1mm(4mil)for HDI / 0.15mm(6mil)
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Min. Line Width:
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0.075mm/0.075mm(3mil/3mil)
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Min. Line Spacing:
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0.003''
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Surface Finishing:
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HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
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Board Size:
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custom
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Layer No.:
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2-32 Layers
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PCB Test:
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Flying probe and AOI (Default)/Fixture Test
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Base, Cover film, Stiffeners thickness::
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0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
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BGA Ball Pitch:
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1mm ~ 3mm(4mil ~ 12mil)
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PCB Assembly Method:
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SMT, Through-hole, Mixed, BGA
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PCB Assembly Test:
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Visual Inspection (default), AOI, FCT, X-RAY
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Hi-TG FR4 Material:
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Tg-130 Tg-140 Tg-160 Tg-170
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Electrical Testing:
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Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
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Certificate Standard:
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IPC-A-600H Class 2, Class 3, TS16949,,ROHS and as your need
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Special requirements:
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Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Quick Details
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Base Material:
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FR-4/CEM-1/CEM-3/Polyimild/PTFE/Rogers
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Board Thickness:
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0.2-6mm
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Model Number:
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PCB/PCBA
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Place of Origin:
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Guangdong, China
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Brand Name:
-
FS
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Copper Thickness:
-
0.4-2mil(10-50um)
-
Min. Hole Size:
-
0.1mm(4mil)for HDI / 0.15mm(6mil)
-
Min. Line Width:
-
0.075mm/0.075mm(3mil/3mil)
-
Min. Line Spacing:
-
0.003''
-
Surface Finishing:
-
HASL/OSP/Ag/ENIG/ENEPIG/Immersion silver/Tin
-
Board Size:
-
custom
-
Layer No.:
-
2-32 Layers
-
PCB Test:
-
Flying probe and AOI (Default)/Fixture Test
-
Base, Cover film, Stiffeners thickness::
-
0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
-
BGA Ball Pitch:
-
1mm ~ 3mm(4mil ~ 12mil)
-
PCB Assembly Method:
-
SMT, Through-hole, Mixed, BGA
-
PCB Assembly Test:
-
Visual Inspection (default), AOI, FCT, X-RAY
-
Hi-TG FR4 Material:
-
Tg-130 Tg-140 Tg-160 Tg-170
-
Electrical Testing:
-
Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
-
Certificate Standard:
-
IPC-A-600H Class 2, Class 3, TS16949,,ROHS and as your need
-
Special requirements:
-
Buried and blind vias, Impedance control, via plug, BGA soldering etc.
Custom adaptive built-in pcb antenna omni directional wifi fpc 5g 2.4g 868mhz esp32 gsm gold plated pcb antenna pcb antenna
Products Description
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SMT Lines
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7 Lines
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Capacity
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8 Million Placements Per Day
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Max Board Size
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680*550mm Smallest:0.25"*0.25"
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Min Components size
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0201-54 sq.mm (0.084 sq.inch),Long Connector,CSP,BGA,QFP
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Speed
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0.15sec/chip, 0.7sec/QFP
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wave-Solder
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Max.PCB Width:450mm
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Min.PCB Width:unlimited
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Components Height:Top 120mm/Bot 15mm
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Metal Types:Part,Whole,Inlay,Side-step
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Metal Material:Copper,Aluminum
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Surface Finish:Plating Au,Plating Silver,Plating Sn
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Air Bladder Rate:less than 20%
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Press Range:0-50KN
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Max.PCB Size:800*600mm
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Assembly Types
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SMT and Thru-hole
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Solder Type
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Water Soluble Solder Paste,Leaded and Lead-Free
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File Formats
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Bill of Materials ,Gerber Files,Pick-N-Place Files(XYRS)
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Type of Service
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Turn-Key,Partial Turn-Kye or Consignment
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Component Packaging
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Cut Tape,Tube Reels Loose,Parts
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Turn Time
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1-15days
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Testing
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XRAY Inspection,AOI Testing ICT,Flying Probe,Burn-in,Function Test
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