Products
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive
Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive

Deepmaterial Low Temperature One-component Hard Ultraviolet Curing Welding Glue Clear Epoxy Resin Underfill MetalAdhesive

FOB Reference Price: Get Latest Price
≥100 Pieces
US $9
≥300 Pieces
US $8.8
≥500 Pieces
US $8.6
Free Inquiry
Customized Request
  • Product Details
  • {{item.text}}

Quick Details

Place of Origin:
Guangdong, China
Brand Name:
DeepMaterial
Model Number:
DM-6108
Type:
Epoxy adhesive
Product name:
Low temperature epoxy adhesive
Characteristic:
With any temperature and thermal treatment, matt excellent adhesion
Curing conditions:
20min@80°C
Color:
Blace
Form:
Single component
Viscosity cps:
17000
Hardness:
88D
Application:
CMOS and other temperature sensitive devices are bonded

Quick Details

CAS No.:
DM-6108
Other Names:
Epoxy adhesive
MF:
none
Place of Origin:
Guangdong, China
Brand Name:
DeepMaterial
Model Number:
DM-6108
Type:
Epoxy adhesive
Product name:
Low temperature epoxy adhesive
Characteristic:
With any temperature and thermal treatment, matt excellent adhesion
Curing conditions:
20min@80°C
Color:
Blace
Form:
Single component
Viscosity cps:
17000
Hardness:
88D
Application:
CMOS and other temperature sensitive devices are bonded
Products Description
Product Name
Low temperature epoxy adhesive
Characteristic
With any temperature and thermal treatment, matt excellent adhesion
Model No
DM-6108
Viscosity cps
17000
Form
Single component
Curing Condition
20min@80°C
Application Scenario
CMOS and other temperature sensitive devices are bonded
Product Series
Product Application
Industry Application
APP
Post My RFQ
WhatsApp
+86-17326049340