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XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip
XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip

XHT customise low MOQ 1.5 2 2.5 3 3.5 mm Welding Wire Desoldering Braid Solder Remover Wick Wire Repair Tool tin absorbing strip

FOB Reference Price: Get Latest Price
≥100 Pieces
US $0.95
≥500 Pieces
US $0.85
Free Inquiry
Customized Request
  • Product Details
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Quick Details

DEM:
YES
Composition:
cu
Material:
cu
Sample Testing:
Support

Quick Details

Place of Origin:
China
Product Name:
desoldering wire
Application:
Soldering kit/ soldering set
DEM:
YES
Composition:
cu
Material:
cu
Sample Testing:
Support

XHT, Top Ten Tin Solder Enterprise

XHT, XingHongTai Tin, Top Ten Tin Solder Enterprise,
Governing Unit and Member of the Electronic Solder Industry Association of China Electronic Materials Industry
Products Description
Details Images
Tin suction wire is a kind of special maintenance consumables. Its appearance greatly reduces the rework / repair time of
electronic products, and greatly reduces the risk of thermal damage to the circuit board.

The tin absorption wire is mainly used to absorb excess solder. In unsoldering, after the chip is removed, there will be a large amount of solder on the circuit board, which will affect the soldering of the chip. Usually use the tin suction belt cleaning, the method is to put the solder iron on the tin suction tape and then slowly move on the chip pad, and so on, the solder will be sucked up by the tin suction belt, despite the tin between the feet, so that the cleaned printed board is very clean.
Key Feature
1. Effectively clean up tin residue
2. Clean the pad of the BGA component
3. Pure copper material + special chemical formula
4. Low residue
Excellent composition
Materials
60% Tin and 40% lead, Customizable
Melting point
Melting point 190°C / 374°F, Customizable
Rosin
Rosin core with 2% flux, Customizable
Weight
225g/roll, Customizable
Diameter
1.0mm(Custom), Customizable
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