- Product Details
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Quick Details
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Place of Origin:
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Guangdong, China
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Copper Thickness:
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15-35 um
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Min. Hole Size:
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0.3-5mm
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Min. Line Width:
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0.3-0.35um
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Min. Line Spacing:
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0.3-0.35um
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Surface Finishing:
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HASL/ENIG/OSP/Immersion silver
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Product name:
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Circuit Board
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Application:
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Electronics Device
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Type:
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Electronic Board
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Certificate:
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CUL/ROHS/ISO9001
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Usage:
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OEM Electronics
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Item:
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Custom Circuit Board
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Solder mask:
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Green. Blue.
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Material:
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FR-4
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Name:
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PCB Board Production
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Service:
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OEM Services Provided
Quick Details
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Base Material:
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Aluminum Base Material
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Board Thickness:
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0.7-1.6 mm
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Model Number:
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HM-LV10231
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Place of Origin:
-
Guangdong, China
-
Copper Thickness:
-
15-35 um
-
Min. Hole Size:
-
0.3-5mm
-
Min. Line Width:
-
0.3-0.35um
-
Min. Line Spacing:
-
0.3-0.35um
-
Surface Finishing:
-
HASL/ENIG/OSP/Immersion silver
-
Product name:
-
Circuit Board
-
Application:
-
Electronics Device
-
Type:
-
Electronic Board
-
Certificate:
-
CUL/ROHS/ISO9001
-
Usage:
-
OEM Electronics
-
Item:
-
Custom Circuit Board
-
Solder mask:
-
Green. Blue.
-
Material:
-
FR-4
-
Name:
-
PCB Board Production
-
Service:
-
OEM Services Provided
Customized Pcb Fabrication 22F 94V0 Pcb Boards Printed Circuit Board Prototype Drone Motherboard
Product Description
PCB Capactity | |
Base Material | FR-4, 22F, CEM-3, CEM-1, aluminum, HB, 94V0 |
Layers | 1-22 layers |
Max Panel | 1550mm*800mm |
Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
Board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm,1.5mm, 2.0mm, 3.0mm and 3.2mm |
Board Thickness | 0.4mm - 4.0mm |
Thickness Tolerance | +/-10% |
Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
Min Hole | 0.2 mm |
Max Working Voltage | 2.5kVDC(0.075mm Dielectric), 3.75kVDC (0.15mm Dielectric) |
Min Track Width | 0.2mm (8mil) |
Min Track Gap | 0.2mm (8mil) |
Min SMD Pad Pitch | 0.2mm (8mil) |
Surface Finishing | HASL lead free, Immersion Gold, Immersion Silver |
Solder Mask Color | Green, Blue etc |
Legend Color | Black, White etc |
E-test | Yes |
Certificate | UL / CUL / ROHS / ISO9001 |
PCB Assembly Capacity | |
Minimum IC Pitch | 0.2mm |
Minimum chip size | 0201(0.2x0.1)/0603(0.6x0.3mm) |
Maximum BGA size | 74x74mm |
BGA ball pitch | 1.00mm(minimum), 3.00mm(maximum) |
BGA ball diameter | 0.40mm(minimum), 1.00mm(maximum) |
QFP lead pitch | 0.38mm(minimum), 2.54mm(maximum) |
Volume |
One piece to low volume production quantities
Low cost first article builds Schedule deliveries |
Assembly type |
Surface mount (SMT) assembly
DIP assembly Mixed (surface mount and through hole) technology Single or double sided placement Cable assembly |
Parts procurements |
Turnkey(we supply the parts)
Consigned(you supply the parts) You supply some parts, we do the rest |
Solder type |
Leaded
Lead-free / ROHS compliant |
Other capabilities |
Repair / rework services
Mechanical assembly Box build Mold and Plastic injection |
Our Services
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