- Product Details
- {{item.text}}
Quick Details
-
Design Printing:
-
No printing
-
Material:
-
silicon
-
Feature:
-
Heat-Resistant
-
Use:
-
MASKING
-
Place of Origin:
-
Fujian, China
-
Brand Name:
-
NAIKOS
-
Model Number:
-
thermal conductive silicon pad
-
Pad Type:
-
Silicone Polyme
-
Sample:
-
Freely
-
Thickness (mm):
-
0.25~12.00
-
Color:
-
Grey/Pink/Blue/Blac
-
Temperature Resistance:
-
-40~+220(℃)
-
Standard Size (mm ):
-
200*400(Customized Available)
Quick Details
-
Adhesive:
-
Silicone
-
Adhesive Side:
-
Single Sided
-
Adhesive Type:
-
Pressure Sensitive
-
Design Printing:
-
No printing
-
Material:
-
silicon
-
Feature:
-
Heat-Resistant
-
Use:
-
MASKING
-
Place of Origin:
-
Fujian, China
-
Brand Name:
-
NAIKOS
-
Model Number:
-
thermal conductive silicon pad
-
Pad Type:
-
Silicone Polyme
-
Sample:
-
Freely
-
Thickness (mm):
-
0.25~12.00
-
Color:
-
Grey/Pink/Blue/Blac
-
Temperature Resistance:
-
-40~+220(℃)
-
Standard Size (mm ):
-
200*400(Customized Available)
Product Description
Properties
Item
|
NKS-###-PAD-TC
|
NKS-###-PAD-MTC
|
NKS-###-PAD-HTC
|
Test Method
|
|||
Reinforced Carrier
|
N/A
|
N/A
|
N/A
|
---
|
|||
Pad Type
|
Silicone Polymer
|
Silicone Polymer
|
Silicone Polymer
|
---
|
|||
Thickness (mm)
|
0.25~12.00
|
0.25~5.0
|
0.25~3.0
|
ASTM D 374
|
|||
Color
|
Grey/Pink/Blue/Black
|
Grey/Pink/Blue/Black
|
Grey/Pink/Blue/Black
|
VISUAL
|
|||
Density(g/cc)
|
1.8~2.8
|
3.0
|
3.2~3.5
|
ASTM D792
|
|||
Hardness(Shore C)
|
30±5
|
25±5
|
25±5
|
ASTM D2240
|
|||
Thermal Conductivity(W/m-k)
|
1.0~2.5
|
2.0~3.0
|
3.0~6.0
|
ASTM D2240
|
|||
Voltage Resistance(KV/mm)
|
>4.0
|
>4.0
|
>4.0
|
ASTM D149
|
|||
Temperature Resistance (℃)
|
-40~+220
|
-40~+220
|
-40~+220
|
ASTM D5470
|
|||
Volume Resistance(Ω .cm)
|
1.0*10
11
|
3.1*10
11
|
3.1*10
11
|
ASTM D257
|
|||
Flame Rating
|
V-0
|
V-0
|
V-0
|
UL-94
|
|||
Standard Size (mm)
|
200*400(Customized Available)
|
|
|
|
TC Soft Thermal Conductive Silicon Pad w/o Reinforcement
NKS Soft Thermal Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic. It can fill the gap between
heat-generating components and heat sink, metal mechanism and shell or other cooling devices. The heat can be transferred out speedily so as to improve the
electronic components' working efficiency and prolong the life-span of equipments.
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