High Temperature Vs-Tp1501 Silicone Thermally Conductive Liquid Gel Material Potting Compound

High Temperature Vs-Tp1501 Silicone Thermally Conductive Liquid Gel Material Potting Compound

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≥10 Kilograms

US $3

≥100 Kilograms

US $2.8

≥500 Kilograms

US $2.5

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Quick Details

Model Number:: VS-TP1501

Type:: silicone potting compound

Color:: Grey

Material:: Silicone rubber

Hardness:: 35 Shore A

Tensile Strength:: 200KPa

Thermal conductivity:: 2.0 Wmk

Density:: 2.3 gcm3

Dielectric Strength:: ≥10 KV mm

Dielectric constant(1000Hz):: 4.7~5.5

Flame retardance:: V-0

Elongation at break:: 12%

Quick Details

Other Names:: thermal gap filler

Place of Origin:: Jiangsu, China

Brand Name:: VOLSUN

Model Number:: VS-TP1501

Type:: silicone potting compound

Color:: Grey

Material:: Silicone rubber

Hardness:: 35 Shore A

Tensile Strength:: 200KPa

Thermal conductivity:: 2.0 Wmk

Density:: 2.3 gcm3

Dielectric Strength:: ≥10 KV mm

Dielectric constant(1000Hz):: 4.7~5.5

Flame retardance:: V-0

Elongation at break:: 12%

Product Overview

Potting Compound Potting Compound for electronics silicone potting compound

Description
VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material that cures at room temperature or after heating to form an elastic thermally conductive silicone rubber, specially designed for the manufacture of electrical and electronic products and modules, such as high Potting protection of power supply modules, frequency converters, sensors, etc., connection and fixation between automotive electronic devices and PCB, etc.

Features

* Continuous operating temperature：-70℃~+200℃
* Excellent mechanical properties and extensibility
* Excellent thermal conductivity and aging resistance
* Low viscosity, self-leveling, excellent drilling ability
* Low modulus, low stress, good adhesion to both metals and plastics

PRODUCT SPECIFICATIONS

Item	Typical Data	Test Method
Mixing ratio	1:1	/
Color(After mixing)	Grey	Visual
Viscosity (Component A) @25℃	5500±500cps	ASTM D2196
Viscosity (Component B) @25℃	5500±500cps	ASTM D2196
Viscosity (After mixing) @25℃	5500±500cps	ASTM D2196
Opening hours @25℃	≥90min	/
Initial setting time @25℃	50-60min	/
Curing condition	30min/50℃；20min/100℃	/
Thermal Conductivity	2.0±0.2 W/m·k	ASTM D5470
Thermal resistance	0.000815m2·k/W	ASTM D5470
Hardness	35±5 Shore A	GB/T 531.1-2008
Density	2.3 g/cm3	GB/T 1033.1-2008
Tensile strength	200KPa	GB/T 528-2009
Elongation at break	12%	GB/T 528-2009
Flame retardance	V-0	UL94
Breakdown strength	≥10 kV/mm	GB/T 1695-2005
Volume resistivity	≥ 1.0×1014 Ω·cm	GB/T 1692-2008
Dielectric constant（1000Hz）	4.7~5.5	GB/T 1693-2007

Dimensions

Size	Package
VS-TP2001（1kg）	Component A: 0.5kg; Component B: 0.5kg
VS-TP2001（20kg）	Component A: 10kg; Component B: 10kg
VS-TP2001（40kg）	Component A: 20kg; Component B: 20kg
VS-TP2001（80kg）	Component A: 40kg; Component B: 40kg
VS-TP2001（100kg）	Component A: 50kg; Component B: 50kg

Note：Special size and packing are available as request.

Instructions
* A and B components are stirred separately
* Mixing the well-stirred components A and B according to the ratio of 1:1 (volume ratio/weight ratio can be used) well
* The mixed compound is poured into the device which need to be sealed, then static curing (Can be cured at room temperature or by heating)

Precautions

* In order to ensure the uniform distribution of fillers, components A and B must be stirred separately before mixing, so that each compounding agent is evenly mixed.

* After A and B are mixed, they will react and cure each other, so they need to be used up after mixing, and they cannot be used twice after mixing and curing.
* When pouring into the protective part, there should be no large debris or other contaminants in the protective part to avoid affecting the mutual adhesion of the material and the object
* Before the material is fully cured, avoid other objects contacting the material, affecting the appearance and protective
performance of the material
* This product should not be in the mouth and eyes. If it accidentally enters the mouth and eyes, rinse it with water in time or go to the hospital for medical treatment.
* If need high thermal conductivity, vacuum degassing is required before pouring
* In low temperature environment, the curing time will be extended accordingly

Storage conditions Shelf life

* The product should be stored in the original packaging, keeping the lid tightly closed to avoid contamination (Temperature: 15℃＜T＜30℃; Relative Humidity: RH＜70%)
* Shelf life is 9 months from the date of manufacture

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