- Product Details
- {{item.text}}
Quick Details
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Usage:
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Polishing,Grinding
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Application:
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Sapphire and SiC wafer
-
Keyword:
-
Diamond Polishing Powder
-
Sample:
-
Sample Provided
-
Packing:
-
Plastic Bottle/Bag
-
Capacity:
-
Large
-
Advantage:
-
factory wholesale
-
Service:
-
Professional After-sales service
Quick Details
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Place of Origin:
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Beijing, China
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Brand Name:
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Grish
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Use:
-
Surface Polishing
-
Usage:
-
Polishing,Grinding
-
Application:
-
Sapphire and SiC wafer
-
Keyword:
-
Diamond Polishing Powder
-
Sample:
-
Sample Provided
-
Packing:
-
Plastic Bottle/Bag
-
Capacity:
-
Large
-
Advantage:
-
factory wholesale
-
Service:
-
Professional After-sales service
Specification
|
item
|
value
|
|
Customized support
|
OEM
|
|
Usage
|
Polishing,Grinding
|
|
Application
|
Sapphire and SiC wafer
|
|
Keyword
|
Diamond Polishing Powder
|
|
Sample
|
Sample Provided
|
|
Packing
|
Plastic Bottle/Bag
|
|
Capacity
|
Large
|
|
Advantage
|
factory wholesale
|
|
Service
|
Professional After-sales service
|
GRISH detonation polycrystalline diamond powder (PCD) is produced in a controlled explosion. Grains microscopic structure is similar with natural Carbonado.
Compared with monocrystalline diamond, PCD has more cutting edges, resulting in the higher removal rate, with good self-sharpening proprieties. The structure will always open new sharp edges introduced by releasing an outer layer of dull crystallites. The polycrystalline diamond can give higher removal rate and lowest level of scratches. That’s why it is especially suitable for the high precision processing on super hard material.
Compared with monocrystalline diamond, PCD has more cutting edges, resulting in the higher removal rate, with good self-sharpening proprieties. The structure will always open new sharp edges introduced by releasing an outer layer of dull crystallites. The polycrystalline diamond can give higher removal rate and lowest level of scratches. That’s why it is especially suitable for the high precision processing on super hard material.
Application:
Sapphire and SiC wafer Optical glass & crystal Ceramic and metal
Features:
◆Higher toughness and better self-sharpening properties compared with monocrystalline diamond.
◆Higher removal rate, less scratches, more consistent polishing performance compared with monocrystalline diamond.
◆High wear resistance and long service life.
◆Higher removal rate, less scratches, more consistent polishing performance compared with monocrystalline diamond.
◆High wear resistance and long service life.
|
Model
|
Grade
|
D10 (µm)
|
D50
(µm) |
D95
(µm) |
Areas of use
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|
PCD 1/8
|
Standard size
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≥0.06
|
0.10-0.14
|
≤0.21
|
Surface polishing of optical crystal, ultra-hard ceramic, wafer substrate and metal.
|
|
PCD 1/4
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|
≥0.11
|
0.20-0.25
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≤0.40
|
|
|
PCD 0-1
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|
≥0.40
|
0.48-0.55
|
≤0.72
|
|
|
PCD 0-2
|
|
≥0.70
|
0.90-1.10
|
≤1.50
|
|
|
PCD 2-4
|
|
≥1.80
|
2.70-3.00
|
≤4.50
|
Lapping, rough polishing and back thinning of sapphire and SiC wafer substrate.
|
|
PCD 3-6
|
|
≥2.80
|
4.00-4.40
|
≤7.00
|
|
|
PCD 4-8
|
|
≥4.00
|
5.50-6.00
|
≤8.60
|
|
|
PCD 5-9
|
|
≥4.70
|
6.30-7.00
|
≤10.00
|
|
|
PCD 5-12
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≥5.20
|
7.20-7.80
|
≤13.00
|
|
|
PCD G3
|
Precision size
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≥2.00
|
2.80-3.10
|
≤4.40
|
|
|
PCD G3.5
|
|
≥2.40
|
3.30-3.60
|
≤5.00
|
|
|
PCD G4
|
|
≥2.90
|
3.90-4.20
|
≤6.00
|
|
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