- Product Details
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Quick Details
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Brand Name:
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DeepMaterial
-
Model Number:
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DM-6987
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Type:
-
One-piece inductor epoxy adhesive
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Product series:
-
One-piece inductor epoxy adhesive
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Colors:
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Clear liquid/White solid
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Form:
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Bicomponent(25:1)
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Density:
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1.15/1.1 g/cm³
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Curing method:
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heat curing
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Operation time:
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<50H
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Working temperature:
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-40~125°C
Quick Details
-
CAS No.:
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DM-6987
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Other Names:
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One-piece inductor epoxy adhesive
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Place of Origin:
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Guangdong, China
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Brand Name:
-
DeepMaterial
-
Model Number:
-
DM-6987
-
Type:
-
One-piece inductor epoxy adhesive
-
Product series:
-
One-piece inductor epoxy adhesive
-
Colors:
-
Clear liquid/White solid
-
Form:
-
Bicomponent(25:1)
-
Density:
-
1.15/1.1 g/cm³
-
Curing method:
-
heat curing
-
Operation time:
-
<50H
-
Working temperature:
-
-40~125°C
Product Description
Product Description
DeepMaterial
One-piece inductor epoxy adhesive
D
M-6987 is a molded inductor powder bonding
material used in the press molding process
adhesive. It is a two-component epoxy adhesive,
which component A is a clear epoxy resin solution
; component B is a curing agent, which is an off
white flaky solid. The product has high strength, good granulation characteristics and high powder yield.
Application
Application
Lead, epitaph and silicon wafers
Protection from environmental, mechanical damage and corrosion.
Lead bonding chip
Encapsulation, cofferdam, and gap filling
Flip chip
CCD/CMOS component and VCM motor assmbly
Related Products
Related Products
$15 - $ 20 Pieces
500 Pieces
(MOQ)
$15 - $ 20 Pieces
500 Pieces
(MOQ)
$15 - $ 20 Pieces
500 Pieces
(MOQ)
Packing & Delivery
Packing & Delivery
Company Introduction
Company Introduction
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor, electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products.
Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
Our Advantages
Our Advantages
Contact Us:
Contact Person: Kiana Zhu Add:7th Floor, Building C, Comlong Science & Technology Park Guanlan High-tech Park, Longhua District, Shenzhen, Guangdong China Tel/Whatsapp/Wechat:+86-15360927891 ite: https://www.deepmaterialcn.com/
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