Products
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue
Low temperature PA adhesive copolyamide hot melt glue

Low temperature PA adhesive copolyamide hot melt glue

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≥1000 Kilograms
US $5.5
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Quick Details

Place of Origin:
Shanghai, China
Brand Name:
JCC
Model Number:
PA-6106
Type:
PA granule/powder
chemical:
bonding material/glue

Quick Details

CAS No.:
None
Other Names:
PA hot melt adhesive
EINECS No.:
None
Place of Origin:
Shanghai, China
Brand Name:
JCC
Model Number:
PA-6106
Type:
PA granule/powder
chemical:
bonding material/glue

Product Description

Feature:

1. Excellent water wash resistance; dry cleaning resistance; solvent resistance; high & low temperature resistance.

2. Different grandes can be provided for extrusion, injection, blowing processes.

Specification:

1. 0-80um (Suitable for heat transfer printing; flocking; gliding and paste dot.)

2. 0-120um/0-160um/0-170um (Suitable for powder dot interlining.)

3. 80-170um/80-200um (Suitable for double dot interlining.)

4. 125-200um/150-250um/180-420um (Suitable for scattering process.)

Technical Data:

Type JCC-PA 6106
Melting range DSC(℃) 100-110
Melting Flow Index(g/10min,160℃) 40-60
Press temperature(℃) 120
Press pressure(Bar) 1.0-3.0
Press time(s) 14
Form P,G
Washing temperature(℃) 40
Dry cleaning Yes

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