DeepMaterial Two-component Epoxy Structural Auto Glass Adhesive

DeepMaterial Two-component Epoxy Structural Auto Glass Adhesive

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EINECS No.:: DM-6030

Place of Origin:: Guangdong, China

Brand Name:: DeepMaterial

Model Number:: DM-6030

Type:: Two-component Epoxy Structural Adhesive

Product name:: Two-component Epoxy Structural Adhesive

Material:: One-component potting materials

Storage temperature:: -20-8℃

Curing method:: Heat curing

Use:: for bonding, small potting, stubbing, and lamination

Color:: Light yellow to amber

Product Description:: low-viscosity, epoxy adhesive industrial product

Curing system:: cured at room temperature with minimal shrinkage

Feature:: optical clarity and excellent structural

Glue type:: Epoxy resin-based

Quick Details

CAS No.:: DM-6030

Other Names:: Two-component Epoxy Structural Adhesive

MF:: NONE

EINECS No.:: DM-6030

Place of Origin:: Guangdong, China

Brand Name:: DeepMaterial

Model Number:: DM-6030

Type:: Two-component Epoxy Structural Adhesive

Product name:: Two-component Epoxy Structural Adhesive

Material:: One-component potting materials

Storage temperature:: -20-8℃

Curing method:: Heat curing

Use:: for bonding, small potting, stubbing, and lamination

Color:: Light yellow to amber

Product Description:: low-viscosity, epoxy adhesive industrial product

Curing system:: cured at room temperature with minimal shrinkage

Feature:: optical clarity and excellent structural

Glue type:: Epoxy resin-based

PRODUCT DESCRIPTION

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board.

Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing.

DeepMaterial's flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application.

It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant to various chemicals and solvents, and has excellent dimensional stability in a wide temperature range. Typical applications include bonding, small potting, stubbing, and lamination. These applications require optical clarity

and excellent structural, mechanical, and electrical insulation properties.

Product Description

PRODUCT FEATURE

Fast cure
One component
Cures in shadowed areas
Easy dispensability without stringing
Fluorescent under UV light

APPLICATION

For assembly process of electron product, especially protection of WLCSP and BGA on

circuit board
Suitable for glass, metal, PC substrate adhesion in industrial applications, typical

application is mainly used for electronic components of moisture-proof protection.

PHYSICAL PROPERTIES

Chemical composition	polymer
Number of components	single-component
Technical characteristics	fast curing, UV-polymerized
Applications	It is a low-viscosity, epoxy adhesive industrial product. After mixing, the two-component epoxy resin is cured at room temperature with minimal shrinkage to form an ultra-clear adhesive tape with excellent impact resistance. The fully cured epoxy resin is resistant to various chemicals and solvents, and has excellent dimensional stability in a wide temperature range. Typical applications include bonding, small potting, stubbing, and lamination. These applications require optical clarity and excellent structural, mechanical, and electrical insulation properties.
Working temperature	100 °C, 120 °C (212 °F)

FAQ

1. What’s the minimum order quantity(MOQ)?
- Minimum 1 unit, small batch and large volumes are acceptable.

2. When can I get the quotation?
- We usually respond within 24 hours on working days receiving your messages. After we receive the TDS report or sample, we will forward to you with quotation within one week.

3. Which is the safe payment method to trade?
- We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.

4. How long does it take to deliver?
- For standard adhesive, it will be 7 days for manufacturing.
- For non-standard adhesive, it will be negotiated customized according to your requirements.

5. What’s the shipping method?
- We are able to ship worldwide where Ocean shipping or Air shipping can reach.
- We have a professional packaging team. Products will be packed safely and protectively.

Factory Introduction

Our Factory specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.