- Product Details
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Quick Details
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Country of Origin:
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Guangdong, China
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Brand:
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Sunsoar PCB
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Material:
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FR4
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Product name:
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Filling Material, Teflo-n, PI
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Our service PCB:
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Turnkey PCBA
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PCB Clone:
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Housing
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PCB Assembly:
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Component sourcing
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PCB manufacturing:
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1 to 64 layers
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Sanforized Buried via:
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Blind via
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Mixed Pressure:
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Embedded Resistance
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Embedded Capacitance:
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Local Mixed Pressure
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impedance controL:
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pcb board
Quick Details
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Model Number:
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Material
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Chipset:
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pcb pcba Customized
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Application:
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IoT Device, Smart Meter, Smart Home
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Country of Origin:
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Guangdong, China
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Brand:
-
Sunsoar PCB
-
Material:
-
FR4
-
Product name:
-
Filling Material, Teflo-n, PI
-
Our service PCB:
-
Turnkey PCBA
-
PCB Clone:
-
Housing
-
PCB Assembly:
-
Component sourcing
-
PCB manufacturing:
-
1 to 64 layers
-
Sanforized Buried via:
-
Blind via
-
Mixed Pressure:
-
Embedded Resistance
-
Embedded Capacitance:
-
Local Mixed Pressure
-
impedance controL:
-
pcb board
Factory Show
Bom Gerber Files Pcba Service Electronics Manufacturer Communication Assembly Printed Circuit Boards PCB
What We can Do
Product Description
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1
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Material
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FR4, (High Tg FR4, General Tg FR4, Middle Tg FR4), Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI
Material, BT Material, PPO, PPE etc. |
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2
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Board thickness Mass production
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394mil(10mm) Samples: 17.5mm.
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3
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Surface finish
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HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger.
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4
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PCB Max panel size
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1150mm × 560mm
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5
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Layer
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Mass production: 2~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers.
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6
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Min hole size
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Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
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7
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PCBA QC
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X-ray, AOI Test, Functional Test
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8
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Special Process
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Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and
Resistance control. |
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9
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Our service
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PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, PCB manufacturing from 1 to 64 layers.
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10
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Sanforized
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Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back
drill, impedance control. |
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11
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SMT Capacity
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5Million Points/Day
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12
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DIP Capacity
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0.35Million Points/Day
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13
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Certificate
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94v-0,CE,SGS,FCC,RoHS,ISO9001.
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Packing & Delivery
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