- Product Details
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Quick Details
Quick Details
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Brand name:
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wanshe
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Material:
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aluminum alloy
Description:
Professional maintenance tool set for removing mobile phone chip.
BGA repair, disassembly of CPU chip and mobile phone repair.
Five different specifications for different needs.
It can be used to separate welds.
Used to dismantle circuit board chip and other components.
Features:
The knife blades are made of stainless steel
Multiple Ultra-thin blades, capricious good, it can ease between the chip and the phone circuit board at the end, is not easy to lead off point.
Specifications:
Material: plastic & stainless steel
Notes:
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2. Please allow 1-3cm measuring deviation due to manual measurement.
Application:
Mobile Phone BGA IC Chip Repair
CPU Glue Removing Tools
Motherboard BGA Dissembling and Assembling
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