Explore More Products
- Product Details
- {{item.text}}
Quick Details
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
TOPFAST ELECTRONIC LIMITED
-
Copper Thickness:
-
0.5-2oz
-
Min. Hole Size:
-
0.1-0.5mm
-
Min. Line Width:
-
3mil
-
Min. Line Spacing:
-
3mil
-
Surface Finishing:
-
ENIG,HASL,OSP,ENEPIG,Flash Gold
-
Board Size:
-
Custom pcb board for gerber files
-
Keywords:
-
inverter circuit board
-
Max Layer:
-
8L
-
Product quotation:
-
Within 10 minutes
-
PCB Standard:
-
IPC-A-600
-
Sample delivery:
-
Within 2 minutes
-
Service:
-
24h technical services
-
Solder Mask:
-
Green Solder Mask/Black PI/Yellow PI
-
Legend:
-
White, Black, Red, Yellow
-
Product name:
-
circuit board inverter
Quick Details
-
Base Material:
-
PI, ShengYi, Dupont
-
Board Thickness:
-
0.1-0.5mm
-
Model Number:
-
pcb circuit boards
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
TOPFAST ELECTRONIC LIMITED
-
Copper Thickness:
-
0.5-2oz
-
Min. Hole Size:
-
0.1-0.5mm
-
Min. Line Width:
-
3mil
-
Min. Line Spacing:
-
3mil
-
Surface Finishing:
-
ENIG,HASL,OSP,ENEPIG,Flash Gold
-
Board Size:
-
Custom pcb board for gerber files
-
Keywords:
-
inverter circuit board
-
Max Layer:
-
8L
-
Product quotation:
-
Within 10 minutes
-
PCB Standard:
-
IPC-A-600
-
Sample delivery:
-
Within 2 minutes
-
Service:
-
24h technical services
-
Solder Mask:
-
Green Solder Mask/Black PI/Yellow PI
-
Legend:
-
White, Black, Red, Yellow
-
Product name:
-
circuit board inverter
|
PCB Assembly Capability
|
|
|
|
Item
|
Capability
|
|
|
Advantages
|
----Professional Surface-mounting and Through-hole soldering technology
|
|
|
|
----Various sizes like 1206,0805,0603 components SMT technology
|
|
|
|
----ICT(In Circuit Test),FCT(Functional Circuit Test)
|
|
|
|
----PCB Assembly With UL,CE,FCC,Rohs Approval
|
|
|
|
----Nitrogen gas reflow soldering technology for SMT.
|
|
|
|
----High Standard SMT&Solder Assembly Line
|
|
|
|
---
-
High density interconnected board placement technology capacity.
|
|
|
Components
|
Passive Down to 0201 size
|
|
|
|
BGA and VFBGA
|
|
|
|
Leadless Chip Carriers/CSP
|
|
|
|
Double-sided SMT Assembly
|
|
|
|
Fine Pitch to 0.8mils
|
|
|
|
BGA Repair and Reball
|
|
|
|
Part Removal and Replacement
|
|
|
Quantity
|
Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized
|
|
|
Type of Assembly
|
SMT, Thru-hole
|
|
|
Solder Type
|
Water Soluble Solder Paste, Leaded and Lead-Free
|
|
|
Bare Board Size
|
Smallest:0.25*0.25 inches
|
|
|
|
Largest:20*20 inches
|
|
|
File Formate
|
Gerber files, Pick-N-Place file, Bill of Materials
|
|
|
Types of Service
|
Turn-key,partial turn-key or consignment
|
|
|
Component packaging
|
Cut Tape,Tube,Reels,Loose Parts
|
|
|
Turn Time
|
Same day service to 15 days service
|
|
|
Testing
|
Flying Probe Test,X-ray Inspection AOI Test
|
|
|
PCB assembly process
|
Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing
|
|
Hot Searches
