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Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor
Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor

Factory directly supply Inner diameter Saw machine for wafer/glass/ceramics/crystal/semiconductor

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≥1 Sets
US $5000
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Quick Details

Voltage:
380V
Rated Power:
1kw
Dimension(L*W*H):
1000mm1100mm1600mm
Year:
new
Weight (KG):
1000 KG
After-sales Service Provided:
Engineers available to service machinery overseas
Weight:
1000kg
Certification:
ce

Quick Details

Place of Origin:
Beijing, China
Brand Name:
MINDER
Marketing Type:
New Product 2023
Voltage:
380V
Rated Power:
1kw
Dimension(L*W*H):
1000mm1100mm1600mm
Year:
new
Weight (KG):
1000 KG
After-sales Service Provided:
Engineers available to service machinery overseas
Weight:
1000kg
Certification:
ce

Details

Inner diameter  saw machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material.

Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating,  the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product.

We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models.

For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time.

Main technical parameters:

MD-J5060

Max machining size(mm) : φ60 ×80 mm

Cutting speed (cm²/mm):3-6(cm²mm)

Degree of balance sheets by cutting deviation(mm) : ±0.005mm

Cutting film thickness(mm) : ≥0.30

The thin-cut tolerance (mm) : ±0.015mm

Horizontal stroke(mm):120mm

Longitudinal travel(mm) : 100mm

Longitudinal degrees:0-100Grid, each grid To 0.01,Each turn a lap in order to1mm

Spindle Electrical :3 Phase 380V 0.75kw

Spindle Speed (r/min) : 3500Rev / min

Adjust the amount of work table :

Horizontal angle : ±45º

Pitch angle of elevation : ±10º

Vertically(mm):24

Cooling tank capacity(kg) : 50kg

Cooling tank motor : 3 Phase 380V 0.12kw 2780r/min

Power : Three-phase four-wire 50Hz 380V

Dimensions(mm) : 1000 ×1100 ×1600

Weight(kg) :~ 1000(kg)

MD-J5090

Main technical parameters:

Max machining size(mm) : φ95 ×80 mm

Cutting speed cm²/mm):3-6cm²/mm)

Degree of balance sheets by cutting deviation(mm) : ±0.005mm

Cutting film thickness(mm) : ≥0.30

The thin-cut tolerance(mm) : ±0.005mm

Horizontal stroke(mm):120mm

Longitudinal travel(mm) : 110mm

Spindle Electrical :3 Phase 0.75kw

Spindle Speed (r/min) :28 00Rev / min

Adjust the amount of work clamp :

Horizontal angle : ±45º

Pitch angle of elevation : ±10º

Vertically(mm):20

Cooling tank capacity(kg) : 50kg

Cooling tank motor : 3 Phase 0.12kw 2780r/min

Power : Three-phase four-wire 50Hz 380V

Dimensions(mm) : 1130 ×850 ×1500

Weight(kg) :~ 1400(kg)

Click here or below photo to see all the inner circle slicing machine to choose a suitable one.

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