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electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation
electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation

electrical two component transparent silicone for pcb potting compound thermo curing clear silicone encapsulation

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≥100 Kilograms
US $8.1
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Quick Details

EINECS No.:
200-902-6
Place of Origin:
Henan, China
Brand Name:
JIAGU
Model Number:
HY585T
Type:
two-component silicone potting
Product name:
silicone potting compound
Color A/B:
transparent
Density (g/cm3):
1.3~1.5
Viscosity (Pa.S):
2.5~6.5
Full curing time (h):
24
Curing time (60℃,min):
40
Shore Hardness (Shore A):
30~65
Dielectric strength (kv/mm):
≥18
Volume resistance (Ω.cm):
≥1.0*10 14
Applicable temperature (℃):
-60~200

Quick Details

CAS No.:
67763-03-5
Other Names:
silicone potting compound
MF:
H4Si
EINECS No.:
200-902-6
Place of Origin:
Henan, China
Brand Name:
JIAGU
Model Number:
HY585T
Type:
two-component silicone potting
Product name:
silicone potting compound
Color A/B:
transparent
Density (g/cm3):
1.3~1.5
Viscosity (Pa.S):
2.5~6.5
Full curing time (h):
24
Curing time (60℃,min):
40
Shore Hardness (Shore A):
30~65
Dielectric strength (kv/mm):
≥18
Volume resistance (Ω.cm):
≥1.0*10 14
Applicable temperature (℃):
-60~200
Product Description
HY585 silicone potting sealant is a two-component, room temperature curing, condensation and dealcoholization type of silicone potting material. Self-leveling, high and low temperature resistance , excellent aging resistance, insulation, moisture resistance and shock resistance. Used in various bonding and sealing of electronic components.

Product Features
1. Solvent-free, environmentally friendly and low-carbon
2. Excellent weather resistance, aging resistance, UV resistance
3. It is insulation, moisture-proof, shock- resistance
4. Suitable for potting and sealing of electronic components
5. Non-corrosive
Application
HY585T is suitable for potting and sealing of pcb electronic components with transparency requirements.
Technical Parameters
Model
HY585T
Color A/B
Transparent
Density (g/cm3)
0.95~1.05
Viscosity (Pa.S)
0.5~1.5
Operation time (min)
60~90
Full curing time (h)
24
Curing time (60℃,min)
40
Shore Hardness (Shore A)
30~65
Shear strength (MPa)
0.8
Thermal conductivity(W/m•k)
0.3
Flame retardant grade (UL94)
HB
Dielectric strength (kv/mm)
≥18
Volume resistance (Ω•cm)
≥1.0×10 14
Applicable temperature (℃)
-60~200
Quality inspection
Obtained a number of patent certificates Latest IOS 9001-2020; UV: CE and other international safety certification
Packaging specification
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