5 Guns RF Plasma Magnetron Sputtering System

Features

• 5 magnetron sputtering guns for 5 different target materials
• Depending on the power supplies used (RF or DC), both metallic and non-metallic materials can be deposited.
• Capable of sputtering 5 target materials to produce various compositions via different sputtering times / rates
• With optional 5 power supplies, 5 target materials can be sputtered at the same time for combinatorial sputtering
• 16 samples can be deposited in one batch with a mask and a rotating sample holder

Input Power

• Single phase 220 VAC, 50 / 60 Hz
• 1000 W (including vacuum pump and water chiller)

Power Source

• One 13.5 MHz,300 W auto-match RF generator is included and connected to the sputtering heads
• The rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched “in the plasma” without breaking of vacuum during a multilayer process.
• Multiple RF power supplies are optional, which allows user to sputter multi-target at the same time for combinatorial sputtering
• Laptop with control software is available at extra cost to control each RF gun's sputtering time and power

Optional

• You may choose DC power supply for metallic target sputtering
• With five DC or RF power supplies, 5 target materials can be sputtered at the same time for combinatorial sputtering

Magnetron Sputtering Head

• Five 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps
• RF cable replacement can be purchased at TMAX
• One manually operated shutter is built on the flange (See Pic #3)
• One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads

Sputtering Target

• Target size requirement: 1" diameter x 1/8" thickness max
• Sputtering distance range: 50 – 80 mm adjustable
• Sputtering angle range: 0 – 25° adjustable
• 1" diameter Cu target and Al2O3 target are included for demo testing
• Various oxide 1” sputtering targets are available upon request at extra cost
• For target-bonding, 1 mm and 2 mm copper backing plates are included. Silver epoxy (Pic #1) and extra copper backing plates (Pic #2) can be ordered at TMAX

Vacuum Chamber

• Vacuum chamber is made of 304 stainless steel with reinforcing rib
• Inside vacuum chamber size:  470 mm L × 445 mm D × 522 mm H  (~105 Liters, 18.5“x17.5"x 20.5")
• Round 380 mm Dia. hinged type door with 150 mm Dia glass window
• Temperature range: -15 to 150 °C
• Vacuum level: 4.0E-5 torr with turbo pump

Sample Holder

• 150 mm diameter rotatable sample holder for coating 16 sample one one batch with different compositions
• Sample holder and mask rotation can be controlled manually by a button or automatically by a control software (Optional)
• The sample holder temperature is adjustable from RT to 600 °C max

Vacuum Pump

• KF40 vacuum port is built in for connecting to a vacuum pump.
• A compact turbo pump is included
• 4.0E-5 Torr with optional turbo pump

Optional

• Precision quartz thickness sensor is optional. It can be built into the chamber to monitor coating thickness with accuracy 0.1 Å (water cooling required)
• Easy USB connection to PC for remote thickness and coating speed monitoring
• 5 pcs quartz sensors (consumable) are included

Net Weight

• 60 kg

Compliance

• CE approval
• MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote.

Warranty

• One years limited warranty with lifetime support

Application Notes

• This compact 1" RF magnetron sputtering coater is designed for coating oxide thin films on oxide single crystal substrates, which usually does not need high vacuum set-up
• A two-stage pressure regulator (not included) should be installed on the gas cylinder to limit the output pressure of gas to below 0.02 MPa for safe usage. Please use > 5N purity Ar gas for plasma sputtering
• For the best film-substrate adhesion strength, please clean the substrate surface before coating:
• Ultrasonic cleaning with the following sequential baths - (1) acetone, (2) isopropyl alcohol - to remove oil and grease. Blow dry the substrate with N2, then hot bake in vacuum to remove absorbed moisture
• Plasma cleaning may be needed for surface roughening, surface chemical bonds activation, or additional contamination removal
• A thin buffer layer (~5 nm), such as Cr, Ti, Mo, Ta, could be applied to improve adhesion of metals and alloys

• For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below (#3) for target-bonding
• Lith supplies single crystal substrate from A to Z
• Lith RF Plasma Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C
• Test the flexibility of the thin film/coated electrode with EQ-MBT-12-LD mandrel bending tester.
• HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF generator before sample loading and target changing operations
• DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water