- Product Details
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Quick Details
-
Weight (KG):
-
5500
-
Application:
-
semiconductor Silicon Carbide/Sapphire/Ceramic
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Max Diameter of grinding workpiece:
-
360mm
-
Min Thickness of Grinding Workpiece:
-
0.2mm
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Max Working Pressure:
-
500Kg
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Flatness of Lapping Disc:
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0.008mm
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Lapping Disc Size:
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Diameter 1127x397x50mm
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Max Rotation Speed of Upper/Lower Plate:
-
60R/min
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Machine Type:
-
Double Sided Lapping Polishing Machine
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QTY of Feeding Carrier:
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5Pcs
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Total Machine Power:
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21KW
Quick Details
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Place of Origin:
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Hunan, China
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Brand Name:
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YUHUAN
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Power (kW):
-
21
-
Weight (KG):
-
5500
-
Application:
-
semiconductor Silicon Carbide/Sapphire/Ceramic
-
Max Diameter of grinding workpiece:
-
360mm
-
Min Thickness of Grinding Workpiece:
-
0.2mm
-
Max Working Pressure:
-
500Kg
-
Flatness of Lapping Disc:
-
0.008mm
-
Lapping Disc Size:
-
Diameter 1127x397x50mm
-
Max Rotation Speed of Upper/Lower Plate:
-
60R/min
-
Machine Type:
-
Double Sided Lapping Polishing Machine
-
QTY of Feeding Carrier:
-
5Pcs
-
Total Machine Power:
-
21KW
China manufacturer high quality auto precision surface grinding machine double sided lapping polishing semiconductor wafer ceramic
YUHUAN DOUBLE DISC SURFACE Lapping Polishing Machine is mainly used for high-precision double-sided grinding and polishing of thin slice parts made of silicon carbide, sapphire, gallium nitride, zirconium oxide, silicon nitride, beryllium nitride, aluminum oxide, aluminum nitride ceramics and other materials, and can realize the end surface of the part high-precision processing requirements.
| No | Item Name | Parameters |
| 1 |
Size of Upper/Lower Plate
(OD*ID *H ) |
Φ1127xΦ397x50mm |
| 2 | Feeding Plate's QTY | 5 Pcs |
| 3 | Max Size of Lapping Workpiece | 335mm(Diameter or Diagonal) |
| 4 | Thickness Range of Lapping Workpiece | 0.2~25mm |
| 5 | Max Processing Pressure | 700kg |
| 6 | Ring Gear Lift Height | 26mm |
| 7 | Max Rotation Speed of Upper/ Lower Plate | 30R/Min,60R/Min |
| 8 | Max Rotation Speed of Sungear | 25R/Min |
| 9 | Max Rotation Speed of Ring Gear | 25R/Min |
| 10 | Motor Power of Upper/ Lower Plate | 7.5KW/7.5KW |
| 11 | Motor Power of the whole Machine | 22KW |
| 12 | Size of The Machine | About 2000× 1600 × 3080mm |
| 13 | The Weight of the Machine | About 6000kg |
1.Moisture-proof packaging+Wooden Box.
2.Special packing requirements available.
