Two-component high-solid induction cold pressing potting epoxy glue

Two-component high-solid induction cold pressing potting epoxy glue

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US $2

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EINECS No.:: DM-6988

Place of Origin:: Guangdong, China

Brand Name:: DeepMaterial

Model Number:: DM-6988

Type:: Two-component high-solid cold pressing epoxy glue

Product name:: Two-component high-solid induction cold pressing potting epoxy glue

Material:: epoxy adhesive

Form:: Bicomponent(18:1)

Density g/cm3:: 1.1/1.1

Use:: suitable for cold pressing process

Color:: Transparent liquid, white solid

Product Description:: high strength, heat aging resistance Excellent performance

Curing system:: fast curing

Application scenario:: Hot-pressed inductor

Curing conditions:: 1H @ 80 ℃, every 15 ℃ increase Heat for 1h until 150 ℃

Quick Details

CAS No.:: DM-6988

Other Names:: Two-component high-solid cold pressing epoxy glue

MF:: NONE

EINECS No.:: DM-6988

Place of Origin:: Guangdong, China

Brand Name:: DeepMaterial

Model Number:: DM-6988

Type:: Two-component high-solid cold pressing epoxy glue

Product name:: Two-component high-solid induction cold pressing potting epoxy glue

Material:: epoxy adhesive

Form:: Bicomponent(18:1)

Density g/cm3:: 1.1/1.1

Use:: suitable for cold pressing process

Color:: Transparent liquid, white solid

Product Description:: high strength, heat aging resistance Excellent performance

Curing system:: fast curing

Application scenario:: Hot-pressed inductor

Curing conditions:: 1H @ 80 ℃, every 15 ℃ increase Heat for 1h until 150 ℃

PRODUCT DESCRIPTION

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial's new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials. DeepMaterial provides formulations for fast filling of very fine pitch parts, fast cure capability, long working and lifespan, as well as the reworkability. Reworkability saves costs by allowing removal of the underfill for reuse of the board.

Flip chip assembly requires stress relief of the welding seam again for extended thermal aging and cycle life. CSP or BGA assembly requires the use of an underfill to improve the mechanical integrity of the assembly during flex, vibration or drop testing.

DeepMaterial's flip-chip underfills have high filler content while maintaining fast flow in small pitches, with the ability to have high glass transition temperatures and high modulus. Our CSP underfills are available in varying filler levels, selected for the glass transition temperature and modulus for the intended application.

PUR structural adhesive:

fast curing speed, excellent adhesion to a variety of materials, and medium maintainability.

PUR structure shading adhesive:

high thixotropy and high OD value, fast reaction speed and high initial strength.

Product Description

PRODUCT FEATURE

A two-component high-solid epoxy adhesive, specially designed for the integrated induction cold pressing process, has high strength, excellent electrical performance and strong versatility.

Good demoulding property,
High strength,
Heat aging resistance Excellent performance,
Suitable for cold pressing process

APPLICATION

⋅ Hot-pressed inductor

PHYSICAL PROPERTIES

Chemical composition	polymer
Number of components	Bicomponent
Technical characteristics	Good demoulding property, high strength, heat aging resistance Excellent performance, suitable for cold pressing process
Applications	Hot-pressed inductor
Working temperature	1H @ 80 ℃, every 15 ℃ increase Heat for 1h until 150 ℃

FAQ

1. What’s the minimum order quantity(MOQ)?
- Minimum 1 unit, small batch and large volumes are acceptable.

2. When can I get the quotation?
- We usually respond within 24 hours on working days receiving your messages. After we receive the TDS report or sample, we will forward to you with quotation within one week.

3. Which is the safe payment method to trade?
- We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.

4. How long does it take to deliver?
- For standard adhesive, it will be 7 days for manufacturing.
- For non-standard adhesive, it will be negotiated customized according to your requirements.

5. What’s the shipping method?
- We are able to ship worldwide where Ocean shipping or Air shipping can reach.
- We have a professional packaging team. Products will be packed safely and protectively.

Factory Introduction

Our Factory specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.