- Product Details
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Quick Details
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EINECS No.:
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DM-6424
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Place of Origin:
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Guangdong, China
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Brand Name:
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DeepMaterial
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Model Number:
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DM-6424
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Type:
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UV Light Adhesive
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Product name:
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UV Light Adhesive
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Material:
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One-component potting materials
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Storage temperature:
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-20-8℃
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Curing method:
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Heat curing
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Color:
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Light amber
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Use:
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Low temperature fast curing
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Product Description:
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Suitable for low-temperature curing of heat-sensitive components
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Curing system:
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Heat cured or UV cured
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Feature:
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High temperature stability and heat shock resistance
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Glue type:
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Epoxy resin-based
Quick Details
-
CAS No.:
-
DM-6424
-
Other Names:
-
UV Light Adhesive
-
MF:
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NONE
-
EINECS No.:
-
DM-6424
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
DeepMaterial
-
Model Number:
-
DM-6424
-
Type:
-
UV Light Adhesive
-
Product name:
-
UV Light Adhesive
-
Material:
-
One-component potting materials
-
Storage temperature:
-
-20-8℃
-
Curing method:
-
Heat curing
-
Color:
-
Light amber
-
Use:
-
Low temperature fast curing
-
Product Description:
-
Suitable for low-temperature curing of heat-sensitive components
-
Curing system:
-
Heat cured or UV cured
-
Feature:
-
High temperature stability and heat shock resistance
-
Glue type:
-
Epoxy resin-based
DeepMaterial UV Light Adhesive
Typical applications include bonding ferrite and electroplating materials in places where quick fixation is required, such as motors, speaker hardware, and jewelry, as well as the place where the product is completely cured outside the bonding line.
PRODUCT FEATURE
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Fast cure
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One component
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Cures in shadowed areas
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Easy dispensability without stringing
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Fluorescent under UV light
APPLICATION
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For assembly process of electron product, especially protection of WLCSP and BGA oncircuit board
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Suitable for glass, metal, PC substrate adhesion in industrial applications, typicalapplication is mainly used for electronic components of moisture-proof protection.
PHYSICAL PROPERTIES
| Type of substrate | for plastics, glass |
| Number of components | single-component |
| Technical characteristics | anaerobic, UV-polymerized, thermally-conductive, impact-resistant |
| Applications | for electronics, for bonding |
| Working temperature |
Min.: -55 °C (-67 °F) Max.: 120 °C (248 °F) |
1. What’s the minimum order quantity(MOQ)?
- Minimum 1 unit, small batch and large volumes are acceptable.
2. When can I get the quotation?
- We usually respond within 24 hours on working days receiving your messages.
After we receive the TDS report or sample, we will forward to you with quotation within one week.
3. Which is the safe payment method to trade?
- We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.
4. How long does it take to deliver?
- For standard adhesive, it will be 7 days for manufacturing.
- For non-standard adhesive, it will be negotiated customized according to your requirements.
5. What’s the shipping method?
- We are able to ship worldwide where Ocean shipping or Air shipping can reach.
- We have a professional packaging team. Products will be packed safely and protectively.
Our Factory specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.
