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Quick Details
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Place of Origin:
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Guangdong, China
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Brand Name:
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Jinghon
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Copper Thickness:
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1OZ
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Min. Hole Size:
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0.10mm
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Min. Line Width:
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0.10mm
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Min. Line Spacing:
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0.075mm
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Surface Finishing:
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OSP
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Board Size:
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OEM
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Product name:
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Aluminum PCB
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Solder mask color:
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Green Blue Black
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Way of shipping:
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DHL/UPS/EMS/Feldex
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Package:
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Vacuum package
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MOQ:
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1piece
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Service:
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EMS/OEM
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Certification::
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ISO9001
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Layer Count:
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1-24 Layer
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Test:
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Flying probe test /test fixture
Quick Details
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Base Material:
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Aluminum
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Board Thickness:
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2mm
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Model Number:
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Customized
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Place of Origin:
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Guangdong, China
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Brand Name:
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Jinghon
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Copper Thickness:
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1OZ
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Min. Hole Size:
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0.10mm
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Min. Line Width:
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0.10mm
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Min. Line Spacing:
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0.075mm
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Surface Finishing:
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OSP
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Board Size:
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OEM
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Product name:
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Aluminum PCB
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Solder mask color:
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Green Blue Black
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Way of shipping:
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DHL/UPS/EMS/Feldex
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Package:
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Vacuum package
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MOQ:
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1piece
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Service:
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EMS/OEM
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Certification::
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ISO9001
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Layer Count:
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1-24 Layer
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Test:
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Flying probe test /test fixture
Manufacture Capacity
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PCB Item
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Manufacture Capacity
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Layer Counts
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1--40L
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Base Material:
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FR4,High-TG FR4,Halogen free,aluminum,High Frequency(Taconic,Aron,PTFE,F4B)
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Max board size(mm)
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1200x400mm
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Board Thickness
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0.4mm--7mm
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Minimum line/space
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0.075mm
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Min Hole Size(mechanical)
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0.15mm
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Min Hole Size(laser hole)
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0.1mm
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Copper Weight
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0.5--6oz
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Surface Finish
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HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP
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Solder Mask
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Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
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Silkscreen
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White, Black, Blue,Yellow
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Acceptable File Format
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Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
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Outline profile
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Rout/ V-cut/ Bridge/ Stamp hole
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FPC Item
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TECHNICAL PARAMETER
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Layers
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1-6 Layers
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Mini thickness
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0.08mm
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Min.Line Width
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0.05mm
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Min.Hole Size
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0.15mm PTH
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Min. PTH Hole Ring
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0.45mm
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Min. Gap between Cover Layer and Pad
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0.1mm
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Min. Gap between Trace and Outline
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0.2mm
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Trace Width Tolerance
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±0.03mm W±30%
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Outline Tolerance
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±0.05mm L≤25mm
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Hole Size Tolerance
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±0.05mm
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Stiffener and Outline Tolerance
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±0.1mm
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Surface Treatment
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ENIG,Gold Plating,HAL,Plating Pb-Sn
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PCBA Item
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TECHNICAL PARAMETER
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Stencil size/range:
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736x736mm
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Minimum IC pitch:
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0.30mm
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Maximum PCB size:
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1200x 500mm
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Minimum PCB thickness:
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0.35mm
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Minimum chip size:
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0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
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Maximum BGA size:
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74x74mm
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BGA ball pitch:
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1.00mm (minimum), 3.00mm (maximum)
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BGA ball diameter:
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0.40mm (minimum), 1.00mm (maximum)
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QFP lead pitch:
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0.38mm (minimum), 2.54mm (maximum)
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Frequency of stencil cleaning:
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1 time/5 to 10 pieces
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Delivery Time
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Sample Lead Time
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Mass Production Lead time
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Single Sided PCB
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1-2 Days
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4-7 Days
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Double Sided PCB
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2-4 Days
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7-10 Days
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Multilayer PCB
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5-8 Days
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10-15 Days
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PCB and Assembly
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8--15 Days
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15--20 Days
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