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Quick Details
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EINECS No.:
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DM-6685
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Place of Origin:
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Guangdong, China
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Brand Name:
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DeepMaterial
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Model Number:
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DM-6685
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Type:
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Medical Adhesives
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Product series:
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UV Light Cure Adhesive
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Colors:
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White
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Viscosity:
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1000- 2000
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Curing method:
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UV 365nm
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Hardness:
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70D
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Store:
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2-28/12M
Quick Details
-
CAS No.:
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DM-6685
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Other Names:
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Medical Adhesives
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MF:
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NONE
-
EINECS No.:
-
DM-6685
-
Place of Origin:
-
Guangdong, China
-
Brand Name:
-
DeepMaterial
-
Model Number:
-
DM-6685
-
Type:
-
Medical Adhesives
-
Product series:
-
UV Light Cure Adhesive
-
Colors:
-
White
-
Viscosity:
-
1000- 2000
-
Curing method:
-
UV 365nm
-
Hardness:
-
70D
-
Store:
-
2-28/12M
Product Description
DeepMaterial Fast Curing Low Temperature One Component High Viscosity Solvent-Free Epoxy Adhesive For
Memory Card CCD CMOS Components
DM-6106 is a single component thermal curing epoxy resin. This product is suitable for low temperature curing, very low
precipitation, high moisture resistance, good adhesion to many materials. Typical applications include memory cards, CCD/CMOS components. It is especially suitable for low curing temperature of heat sensitive elements.
precipitation, high moisture resistance, good adhesion to many materials. Typical applications include memory cards, CCD/CMOS components. It is especially suitable for low curing temperature of heat sensitive elements.
Product Structure:
Black paste epoxy resin
Product Characteristics:
Low temperature curing
Excellent adhesion
Low precipitation
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Product Name
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Low temperature curing epoxy adhesive
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Material
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Epoxy resin based
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Function
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Memory card, CCD/CMOS components
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Volume
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30~50ml/pcs
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Color
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Black
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Application
Lead, epitaph and silicon wafers
Protection from environmental, mechanical damage and corrosion.
Lead bonding chip
Encapsulation, cofferdam, and gap filling
Flip chip
CCD/CMOS component and VCM motor assmbly
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Packing & Delivery
Company Introduction
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in adhesives for semiconductor, electronic applications and surface protection materials for chip packaging and testing.
Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products.
Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
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