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70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks
70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks

70x20x1.5mm Silicone Thermal Conductive Pads tape for Pcie M.2 2280 SSD NVMe Heatsinks

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≥50 Pieces
US $0.8
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Quick Details

Rated Voltage:
6.5kv
Tensile Strength:
30kgf
Product name:
SSD m.2 radiator NVME NGFF Thermal Conductive Pads
Color:
blue,gray,white,pink,green or custom
Thickness:
0.5mm 1mm 1.5mm 2mm 2.5mm
size:
70mm*22mm
MOQ:
100pcs
Sample:
Freely
Certificates:
SGS,UL,
Delivery Time:
3-4days
Packing:
custom packing,OPP bag

Quick Details

Place of Origin:
Fujian, China
Brand Name:
AIMO
Model Number:
2280 SSD-CP
Rated Voltage:
6.5kv
Tensile Strength:
30kgf
Product name:
SSD m.2 radiator NVME NGFF Thermal Conductive Pads
Color:
blue,gray,white,pink,green or custom
Thickness:
0.5mm 1mm 1.5mm 2mm 2.5mm
size:
70mm*22mm
MOQ:
100pcs
Sample:
Freely
Certificates:
SGS,UL,
Delivery Time:
3-4days
Packing:
custom packing,OPP bag
Products Description
Products name
SSD m.2 radiator NVME NGFF Thermal conductive pad
Thickness
0.1mm
0.15mm
Adhesive
Silicon
Hardness
40-80 shore,or custom
Tensile strength
0.34Mpa
Tear Strength
1.4KN/m
Breakdown Voltage
≥10KV/mm
Dielectric Constant
5.41
Thermal Conductivity
1.2W/m.k ,3W/m.k,5W/m.k or custom

Application

Application:

* Flat panel TV, mobile equipment, high-speed hard disk drive * Computer, PC server, workstation
* LED lighting, lighting equipment
* Between semiconductor and heat sink, processors to heatsinks, GPU to heatsinks
* The chip and chip component

Application:

* HDDVD driver IC
* Power conversion
* Automotive engine/trans mission controls
* GPU VRAM
* Mass Storage Drives
* LCD back-light module
* Network communication equipment
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