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Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue
Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue

Aventk UV adhesive Optical fiber protection Suitable For Camera Module PCBA Coating Speaker UV Curing Glue

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≥30 Pieces
US $7.88
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Quick Details

Shelf life:
6 months
Specifications:
10ML/30ML
Product category:
LCP metal rubber
Chemical types:
Epoxy resin
Appearance:
Black liquid
Application material:
CCD / CMOS/VCM
Viscosity:
8500cPs
Density:
1.2
Hardness:
D88

Quick Details

Place of Origin:
Shanghai, China
Brand Name:
AVENTK
Model Number:
1099T60
Shelf life:
6 months
Specifications:
10ML/30ML
Product category:
LCP metal rubber
Chemical types:
Epoxy resin
Appearance:
Black liquid
Application material:
CCD / CMOS/VCM
Viscosity:
8500cPs
Density:
1.2
Hardness:
D88
Products Description
Brand
AVENTK
Shelf life
6 months
Place of Origin:
Shanghai, China
Specifications
10ML/30ML
Product category
LCP metal rubber
Certification
ISO/RoHS/UL
Chemical types
Epoxy resin
Application field
It is designed for CCD/CMOS and VCM components of thermal sensors that require low curing temperatures. Excellent bonding strength
for LCP, metal, etc.
Appearance
Black liquid
Application material
CCD / CMOS/VCM
Viscosity
8500cPs
Elongation at break
2.3%
Density
1.2
Tensile strength at break
34Mpa
Hardness
D88
Vitrification temperature
70℃
Thixotropic value
2.1
Linear shrinkage
0.8%
Flash point
>93℃/200℉
Curing band
365nm
1099T60 is a heat-curable epoxy adhesive. The formula is based on a solvent-free epoxy system of one component products. It is designed for CCD/CMOS and VCM components of thermal sensors that require low curing temperatures. The glue can be cured in ultra-narrow gaps (below 10U). Excellent bonding strength for LCP, metal, etc.
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