Compact Magnetron Sputtering System Coater Sputter Coating Machine

Compact Structure

Input Power

• Single phase 220 VAC 50 / 60 Hz
• 2000 W (including vacuum pump and water chiller)

Source Power

• Two sputtering power sources are integrated into one control box
• DC source: 500 W power for coating metallic materials (Pic 1)
• RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials (Pic 2)

Magnetron Sputtering Head

• Two 2" Magnetron Sputtering Heads with water cooling jackets and shutters are included
• One Sputting Head Model also available in this product page (in product options)
• One is connected to DC source for coating metallic materials
• The other one is connected to RF source for non-conductive materials
• Target size requirement: 2" diameter
• Thickness range: 0.1 - 5 mm for both metallic and non-conductive targets (including backing plate)
• One Stainless Steel Target target and one Research Grade Al2O3 target are included for demo testing
• Optional 2" sputtering targets (or backing plate) are available upon request at extra cost.
• Recommended Sputtering Recipe and Useful Tips
• Customized coater: Two DC heads without RF; two RF heads without DC; 3 RF heads are available upon request
• Optional: 148 cm RF cable can be ordered at extra cost for replacement (Click the 1st pic from right to order)

Vacuum Chamber

• Vacuum chamber: 300 mm Dia. x 300 mm Height, made of stainless steel
• Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
• Hinged type lid with pneumatic power pole allows easy target change

Sample Stage

• Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
• Sample holder size: 140 mm Dia. for. 4" wafer max
• Rotation speed: 1 - 20 rpm adjustable for uniform coating
• The holder temperature is adjustable from RT to 500 °C max (2 hr max) with accuracy +/- 1.0 °C via a digital temperature controller

Gas Flow Control

• Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gasses
• Flow rate: 0 – 200 mL/min adjustable on the touch screen control panel
• Air inlet valve is installed for vacuum release

Vacuum Pump Station

• A mobile pump station is included. The sputtering coater can be placed on top of station
• High-speed turbo pump at speed 80L/S is combined with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
• Standard vacuum level connected with chamber : < 4.0E-5 Torr. .  (1.0E-6 Torr with chamber baking )
• Optional at extra cost
• If choose a 150L/S high speed turbo pump, vacuum can reach 10-6 torr  with chamber  ( 6x10-7 torr with baking)
• For the ultra-high vacuum upto 10^-7 torr, a getter pump (100L/s H2 & O2) is needed in addition to the turbo pump. Please consult our engineers for detailed customization.

Water Chiller

• One digital temperature controlled recirculating water chiller is included.
• Refrigeration range: 5~35 °C
• Flow rate: 16 L/min
• Pump pressure: 14 psi

Optional

• Precise quartz Film Thickness Monitor is optional, which can be into the chamber to monitor coating thickness with an accuracy of 0.10 Å
• Precision Thin Film & Coating Analysis Systems - EQ-TFMS-LD is available at extra cost
• Various 2” oxide and metallic targets are available upon request at extra cost. Silver epoxy and copper backing plates can be ordered at MTI

Overall Dimensions

Net Weight of Coater

• 160 kg

Shipping Weight & Dimensions

• Total 2 Pallets
• #1: 520 lbs, 52" x 40" x 50"
• #2: 420 lbs, 48" x 40" x 45"

Compliance

• CE approval
• MET Certification (UL 1450) is available upon request at extra cost, please contact our sales representative for quote.

Warranty

• One year limited warranty with lifetime support

Application Notes

• A two-stage pressure regulator (not included) should be installed on gas cylinder to limit the gas output pressure below 0.02 MPa for safe usage
• In order to remove oxygen from the chamber, we suggest you to use 5% Hydrogen + 95 % Nitrogen to clean the chamber 2-3 times, which can reduce oxygen level to < 10 ppm
• Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar usually contains 10 - 100 ppm oxygen and H2O depending on the supplier. MTI suggest you to use gas purification device to purify gas before filling in.
• For best performance, the non-conductive targets must be installed with a copper backing plate. Please refer to the instruction video below for target bonding
• LITH supplies single crystal substrate from A to Z
• LITH Sputtering Coaters have successfully coated ZnO on Al2O3 substrate at 500 °C
• Test the flexibility of the thin film / coated electrode with EQ-MBT-12-LD mandrel bending tester.
• HIGH VOLTAGE! Sputtering heads connect to high voltage. For safety, the operator must shut down the RF / DC generator before sample loading and target changing operations
• DO NOT use tap water in water chiller. Use coolant, DI water, distilled water, or anti-corrosive additives with water