- Product Details
- {{item.text}}
Quick Details
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Supplier Type:
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OEM
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Copper Thickness:
-
Custom
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Surface Finishing:
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HASL\OSP\immersion Gold
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Material:
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FR4 /aluminum/ceramic CEM1
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PCBA service:
-
Turnkey Assembly PCBA Service
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Testing Service:
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100% AOI ICT FCT Testing
Quick Details
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Model Number:
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PCBA-201020
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Place of Origin:
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Guangdong, China
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Brand Name:
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FFTEK
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Supplier Type:
-
OEM
-
Copper Thickness:
-
Custom
-
Surface Finishing:
-
HASL\OSP\immersion Gold
-
Material:
-
FR4 /aluminum/ceramic CEM1
-
PCBA service:
-
Turnkey Assembly PCBA Service
-
Testing Service:
-
100% AOI ICT FCT Testing
Custom multilayer pcb board supplier electronics printed circuits board pcb pcba assembly manufacturer
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PCBA Processing Capacity |
||
|
Project |
Large-scale Processing Capacity |
Small-scale Processing Capacity |
|
Layer Count (maximum)
|
2-18 |
20-30 |
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Board Material Types
|
FR-4, Ceramic Board, Aluminum-based Board, PTFE, Halogen-free Board, High Tg Board |
PTFE,PPO ,PPE |
|
Rogers,etc |
E-65,ect |
|
|
Mixed Pressing of Board Materials
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4 layers - 6 layers |
6 layers - 8 layers |
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Maximum Size
|
610mm X 1100mm |
|
|
Dimensional Accuracy
|
±0.13mm |
±0.10mm |
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Board Thickness Range
|
0.2mm--6.00mm |
0.2mm--8.00mm |
|
Thickness Tolerance (t≥0.8mm)
|
±8% |
±5% |
|
Thickness Tolerance (t <0.8mm) |
±10% |
±8% |
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Dielectric Thickness |
0.076mm--6.00mm |
0.076mm--0.100mm |
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Minimum Line Width
|
0.10mm |
0.075mm |
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Minimum Spacing
|
0.10mm |
0.075mm |
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Outer Copper Thickness
|
8.75um--175um |
8.75um--280um |
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Inner Copper Thickness
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17.5um--175um |
0.15mm--0.25mm |
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Drill Hole Diameter (mechanical drilling)
|
0.25mm--6.00mm |
0.15mm--0.25mm |
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Finished Hole Diameter (mechanical drilling)
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0.20mm--6.00mm |
0.10mm--0.20mm |
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Hole Diameter Tolerance (mechanical drilling)
|
0.05mm |
|
|
Hole Position Tolerance (mechanical drilling)
|
0.075mm |
0.050mm |
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Laser-drilled Hole Diameter
|
0.10mm |
0.075mm |
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Board Thickness to Hole Diameter Ratio
|
10:1 |
12:1 |
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Solder Mask Type
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Photosensitive Green, Yellow, Black, Purple, Blue, Ink |
|
|
Minimum Solder Mask Bridge Width
|
0.10mm |
0.075mm |
|
Minimum Solder Mask Isolation Ring
|
0.05mm |
0.025mm |
|
Plug Hole Diameter
|
0.25mm--0.60mm |
0.60mm-0.80mm |
|
Impedance Tolerance
|
±10% |
±5% |
|
Surface Treatment Type
|
Hot Air Leveling, Electroless Nickel Gold, Immersion Silver, Electroplated Nickel Gold, Chemical Tin Plating, Gold Finger Card |
Chemical Tin Plating, OSP |
• automatic solder paste printing
• SPI
• SMT
• Reflow soldering
• AOI • X-RAY (for BGA)
• ICT testing
